EDAPS 2024
The IEEE Electrical Design of Advanced Packaging and Systems (EDAPS) symposium, a flagship event in the Asia-Pacific region, has consistently served as a platform for dissemmination of latest research in the areas of electrical design of…
Enhanced Packaging Performance and Manufacturing with Physics-Based 3D Simulation
About this webinar Digital engineering is ramping up across the CPG, healthcare and wider packaging sector. Packaging engineers are tasked with producing fit-for-purpose packaging that is optimised for customer-use, transportation, storage and for production-line filling/handling.…
User2User Europe 2024
User2User is the perfect opportunity to learn, share and network with fellow technical experts who design leading-edge products using Siemens EDA tools. Dedicated to end-users of Siemens EDA solutions, this conference is free to attend…
56th International Microelectronics Assembly and Packaging Society (IMAPS)
This packed conference brings together industry engineers, researchers and top experts involved in advanced packaging and microelectronics assembly. IMAPS Symposium offers a robust technical program with 5 concurrent tracks and 100+ speakers and posters covering SiP…
19th Annual Device Packaging Conference (DPC 2023)
The most comprehensive event this spring for microelectronics assembly & advanced packaging returns to Fountain Hills, Arizona. The 19th Annual Device Packaging Conference (DPC 2023) will be held March 13-16, 2023, at the WeKoPa Conference Center. This esteemed…
IEEE – Electrical Design of Advanced Packaging and Systems (EDAPS)
The IEEE Electrical Design of Advanced Packaging and Systems (EDAPS) symposium, a flagship event in the Asia-Pacific region, has consistently served as a platform for dissemination of latest research in the areas of electrical design…