User2User Europe 2024
User2User is the perfect opportunity to learn, share and network with fellow technical experts who design leading-edge products using Siemens EDA tools. Dedicated to end-users… Read More »User2User Europe 2024
packaging
56th International Microelectronics Assembly and Packaging Society (IMAPS)
This packed conference brings together industry engineers, researchers and top experts involved in advanced packaging and microelectronics assembly. IMAPS Symposium offers a robust technical program with… Read More »56th International Microelectronics Assembly and Packaging Society (IMAPS)
19th Annual Device Packaging Conference (DPC 2023)
The most comprehensive event this spring for microelectronics assembly & advanced packaging returns to Fountain Hills, Arizona. The 19th Annual Device Packaging Conference (DPC 2023) will be held… Read More »19th Annual Device Packaging Conference (DPC 2023)
IEEE – Electrical Design of Advanced Packaging and Systems (EDAPS)
The IEEE Electrical Design of Advanced Packaging and Systems (EDAPS) symposium, a flagship event in the Asia-Pacific region, has consistently served as a platform for… Read More »IEEE – Electrical Design of Advanced Packaging and Systems (EDAPS)