High-performance workloads demand on-package integration of heterogeneous processing units, on-package memory, and communication infrastructure to meet the demands of today’s data centers, autonomous vehicles, etc. On-package interconnects are a critical component to deliver the power-efficient…
As traditional Moore’s law scaling approaches its physical limits, the industry is moving towards multi-die solutions for higher electronics system densities. Multi-die designs present one way for engineers to pack more functionality into silicon chips…
Why Attend Flash Memory Summit? Flash Memory Summit (FMS) is an all-inclusive international memory and storage showcase. It is the event for the memory and storage industry. It is the one-stop place to catch up…
Chiplets are emerging as a new way of building IC systems via heterogeneous integration, and Universal Chip Interconnect Express (UCIe) is one of the standards defining the interconnects among chiplets. This webinar presents the SystemVerilog…
Wednesday, May 24, 2023 and Thursday, May 25, 2023 The industry is moving to multi-die systems to benefit from the greater compute performance, increased functionality, and new levels of flexibility. Challenges for multi-die systems are…
UCIe™ — Universal Chiplet Interconnect Express™ — is an open industry standard founded by the leaders in semiconductors, packaging, IP suppliers, foundries, and cloud service providers to address customer requests for more customizable package-level integration.…
I had the pleasure to attend the SEMI event held November 2nd in Beaverton, Oregon, just a few miles away from where I live in Tualatin. Biamp hosted the meeting, and their company has been…
Multi-die architectures have evolved from proprietary to industry standard UCIe. UCIe can accommodate the bulk of designs today from 8 Gbps per pin to 32 Gbps per pin for high-bandwidth applications from networking to Hyperscale…
The First Annual Chiplet Summit is the show chip designers can’t miss if they want to stay competitive. They’ll get the scoop on ways to make their chiplets run faster, scale better, use less power,…
Emerging 2.5D and 3DIC packaging technologies enable more design complexity, and bring some new verification challenges. We look at how to scale your verification capability to match and how to plan ahead for verification of…