Exploring the Next Frontier in Chip Integration Webinar Agenda : Introduction to all UCIe layers Decrypting FLITs, PHY Trainings, Bring up flows FDI-RDI , main… Read More »Unleashing Innovation with UCIe
Presenter: Dr. Debendra Das Sharma, UCIe Consortium Chairman and Intel Senior Fellow, Chief Architect of I/O Technology and Standards at Intel The UCIe™ (Universal Chiplet Interconnect… Read More »The UCIe™ 1.1 Specification: Future Applications of Chiplets
Innovative die disaggregation technologies, enable a future where a catalog of chiplets will be available to mix and match based on the end application. The… Read More »UCIe-Based Chiplet Verification – from IP to SoC
Innovative die disaggregation technologies, enable a future where a catalog of chiplets will be available to mix and match based on the end application. The… Read More »UCIe-Based Chiplet Verification – from IP to SoC
High-performance workloads demand on-package integration of heterogeneous processing units, on-package memory, and communication infrastructure to meet the demands of today’s data centers, autonomous vehicles, etc.… Read More »UCIe: On-Package Chiplet Innovation Opportunities
As traditional Moore’s law scaling approaches its physical limits, the industry is moving towards multi-die solutions for higher electronics system densities. Multi-die designs present one… Read More »Step-by-Step Guide for Your UCIe Design Verification
Why Attend Flash Memory Summit? Flash Memory Summit (FMS) is an all-inclusive international memory and storage showcase. It is the event for the memory and… Read More »Flash Memory Summit
Chiplets are emerging as a new way of building IC systems via heterogeneous integration, and Universal Chip Interconnect Express (UCIe) is one of the standards… Read More »UCIe PHY Modeling and Simulation with XMODEL
Wednesday, May 24, 2023 and Thursday, May 25, 2023 The industry is moving to multi-die systems to benefit from the greater compute performance, increased functionality,… Read More »Requirements for Multi-Die System Success
UCIe™ — Universal Chiplet Interconnect Express™ — is an open industry standard founded by the leaders in semiconductors, packaging, IP suppliers, foundries, and cloud service… Read More »Introduction to UCIe