Skip to content

UCIe

Truechip, September 26, 2023

Unleashing Innovation with UCIe​​​​​​​​​​​​​​

Exploring the Next Frontier in Chip Integration Webinar Agenda : Introduction to all UCIe layers Decrypting FLITs, PHY Trainings, Bring up flows FDI-RDI , main… Read More »Unleashing Innovation with UCIe​​​​​​​​​​​​​​

UCIe, October 12, 2023

The UCIe™ 1.1 Specification: Future Applications of Chiplets

Presenter: Dr. Debendra Das Sharma, UCIe Consortium Chairman and Intel Senior Fellow, Chief Architect of I/O Technology and Standards at Intel  The UCIe™ (Universal Chiplet Interconnect… Read More »The UCIe™ 1.1 Specification: Future Applications of Chiplets

Synopsys, August 15, 2023

UCIe: On-Package Chiplet Innovation Opportunities

High-performance workloads demand on-package integration of heterogeneous processing units, on-package memory, and communication infrastructure to meet the demands of today’s data centers, autonomous vehicles, etc.… Read More »UCIe: On-Package Chiplet Innovation Opportunities

Synopsys, August 10, 2023

Step-by-Step Guide for Your UCIe Design Verification

As traditional Moore’s law scaling approaches its physical limits, the industry is moving towards multi-die solutions for higher electronics system densities. Multi-die designs present one… Read More »Step-by-Step Guide for Your UCIe Design Verification

%d bloggers like this: