EDA
VLSID 2024
ITC Royal Bengal Kolkata, IndiaThe 37th International Conference on VLSI Design & the 23rd International Conference on Embedded Systems (VLSID 2024) are being held at Kolkata, India, during January 6-10, 2024. VLSID 2024 is returning to… Read More »VLSID 2024
Speed Up Your Electronic Component Design with HPC
About this Webinar Electronic components design and their integration on PCBs involve complex simulations to predict EM fields and forces accurately. These simulations can be computationally intensive and time-consuming. High-Performance… Read More »Speed Up Your Electronic Component Design with HPC
PCB Design Best Practices: How to fully verify your Serdes-based designs before prototype manufacture
“Right first time” is a goal we all aspire to, but how often does it really happen? Even when we follow layout rules as closely as possible, problems creep into… Read More »PCB Design Best Practices: How to fully verify your Serdes-based designs before prototype manufacture
Meet Advanced IC Package Design Schedule Challenges with In-Design Analysis
The heterogeneous integration of chips/chiplets has added significant complexity to the IC package design process, further compressing schedules for many design teams. Design teams must work more efficiently to meet… Read More »Meet Advanced IC Package Design Schedule Challenges with In-Design Analysis
ASP-DAC 2024
Incheon Songdo Convensia 123 Central Street, Yeonsu-gu, Incheon, Korea, Democratic People's Republic ofASP-DAC 2024 is the 29th annual international conference on VLSI design automation in Asia and South Pacific regions, one of the most active regions of design, CAD and fabrication of… Read More »ASP-DAC 2024
Verisium SimAI: Coverage Gaps Meet Their Match
Every project has some areas that seem impossible to cover. Various factors can cause these nearly impossible-to-hit coverage gaps, including technical complexity, lack of resources, and shifting requirements. In constrained… Read More »Verisium SimAI: Coverage Gaps Meet Their Match
Automotive World 2024
Tokyo Big Sight 3 Choe-11-1 Ariake, Tokyo, JapanCombination of exhibitions & conferences covering important topics in the automotive industry such as automotive electronics, connected car, autonomous driving, EV/HV/FCV, lightweight, processing technology and MaaS. Automotive OEMs and Tier… Read More »Automotive World 2024
Introducing OrCAD X, Our Next-Generation PCB Layout Solution
Whether you’re a beginner or a seasoned engineer, this webinar is a must-watch for anyone in the electronic design space. Join us to discuss how you can accelerate your PCB design… Read More »Introducing OrCAD X, Our Next-Generation PCB Layout Solution
Validating Clarity 3D Solver Accuracy Through Measurement Correlation
Cadence’s Clarity 3D Solver is an industry-leading EM simulation platform used by hundreds of design teams to address signal and power integrity (SI/PI) challenges. By solving bigger problems on more… Read More »Validating Clarity 3D Solver Accuracy Through Measurement Correlation
Verifying AXI Interconnects with ALINT-PRO and Riviera-PRO
AXI has become the most popular internal bus protocol with today’s FPGA and SoC FPGA designs. ALINT-PRO enables FPGA designers to extract, review and statically verify AXI bus interfaces. In… Read More »Verifying AXI Interconnects with ALINT-PRO and Riviera-PRO
DesignCon 2024
Santa Clara Convention Center 5001 Great America Parkway, Santa Clara, CA, United StatesThe Must Attend Event for Chip, Board, and Systems Design Engineers DesignCon is the premier high-speed communications and system design conference and exposition, offering industry-critical engineering education in the heart… Read More »DesignCon 2024
Signal & Power Integrity Special Interest Group
Hilton Santa Clara 4949 Great America Parkway, Santa Clara, CA, United StatesDear SIPI Engineer, As a member of the engineering community, you are invited to attend Synopsys Signal & Power Integrity Special Interest Group event taking place at Hilton Santa Clara.… Read More »Signal & Power Integrity Special Interest Group