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ISTFA 2022
Pasadena Convention Center 300 East Green Stret, Pasadena, CA, United StatesThe demand for higher performance and lower power-consumption microelectronic devices has driven semiconductor technology to shrink continuously according to Moore’s Law. Furthermore, for latest technologies in nano realm, a new… ISTFA 2022
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ICCAD 2022
San Diego Mission Bay Resor 1775 East Mission Bay Drive, San Diego, CA, United StatesJointly sponsored by ACM and IEEE, ICCAD is the premier forum to explore the new challenges, present leading-edge innovative solutions, and identify emerging technologies in the electronic design automation research areas. ICCAD covers… ICCAD 2022
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THE FUTURE OF MORE THAN MOORE—Chiplets, Advanced Packaging, and More
Biamp Systems 9300 SW Gemini Dr., Beaverton, OR, United StatesPresented by the SEMI Pacific Northwest and Silicon Valley Chapters How can we extend Moore's Law and drive new capabilities in the More than Moore era? The answer lies in… THE FUTURE OF MORE THAN MOORE—Chiplets, Advanced Packaging, and More
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Workshop on Open-Source EDA Technology
Virtually co-sponsored by ICCAD 2022 on November 3, 2022! The WOSET workshop aims to galvanize the open-source EDA movement. The workshop will bring together EDA researchers who are committed to… Workshop on Open-Source EDA Technology
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How Designing a Custom ASIC Chip Will Help Scientists Detect Neutrinos From Outer Space
Join us on Thursday, November 3rd to learn how Lawrence Berkeley National Laboratory, Fermilab, and Brookhaven National Laboratory collaborated and designed a custom ASIC chip to run at extremely cold… How Designing a Custom ASIC Chip Will Help Scientists Detect Neutrinos From Outer Space
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TSMC 2022 EU OIP Ecosystem Forum
Hilton Amsterdam Airport Schiphol Schiphol Boulevard 701 Amsterdam, Amsterdam, NetherlandsLearn About: Emerging advanced node design challenges and corresponding design flows and methodologies for N3/N3E, N4/N4P, N5/N5A, N6/N7, N12e, N22, and 28eF technologies Latest 3DIC chip stacking and advanced packaging… TSMC 2022 EU OIP Ecosystem Forum
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Ethernet & IP @ Automotive Technology Day
PACIFICO Yokohama North 1 Chome-1-2 Minatomirai, Nishi Ward, Yokohama, JapanOnsite registration may be limited, register now to be sure to get admission. The 2022 IEEE SA Ethernet & IP @ Automotive Technology Day (E&IP@ATD) is the premier venue for… Ethernet & IP @ Automotive Technology Day
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Achieving Fast Turnaround Time of Functional ECOs with Synopsys Formality ECO
Functional ECOs (engineering change orders) are an important part of the design cycle, enabling design teams to respond quickly to frequent, unexpected, and last-minute register-transfer logic (RTL) functional changes. ECOs… Achieving Fast Turnaround Time of Functional ECOs with Synopsys Formality ECO
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Accelerated development in Automotive E/E Systems using VisualSim Architect
We have put together a webinar on November 10th titled: Accelerated development in Automotive E/E Systems using VisualSim Architect . We will provide an introduction to the available features and… Accelerated development in Automotive E/E Systems using VisualSim Architect
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Engineering best practices for Python-based testbenches with cocotb
Writing code is easy. Reading code is hard. Maintaining code is hard. Writing "good" code is hard. So what's "good code"? Don't despair: the software engineering community has come up… Engineering best practices for Python-based testbenches with cocotb
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Super Computing 2022
Kay Bailey Hutchison Convention Center 650 S Griffin Street, Dallas, TX, United StatesCome see your friends and colleagues, explore incredible learning experiences in HPC, and walk the exhibit floor! There are several registration options available. Choose the one that’s right for you.… Super Computing 2022
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Three Issues Every EE Needs to Overcome to Sign Off on High-Speed PCB Designs
Signal integrity/power integrity (SI/PI) are top priorities for engineers designing today’s high-speed, high-density circuit boards. Faster signoff of designs can be achieved by uncovering signal SI/PI issues early in the… Three Issues Every EE Needs to Overcome to Sign Off on High-Speed PCB Designs
12 events found.