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PDF Solutions – AI Executive Conference
St. Regist Hotel 125 3rd Street, San Francisco, CA, United StatesThis one-day Executive Conference will feature presentations from PDF Solutions executives, industry thought leaders, solutions partners and customers on the state of art and best practices to design, deploy, scale, and manage trusted AI / ML solutions across the global semiconductor industry. Speakers from: ADI, Advantest, Cerebras, Intel, Microsoft, SAP, Siemens, TEL, Teradyne, Voltai, Yurts and… PDF Solutions – AI Executive Conference
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From Concept to QoR: Practical Generative AI for ASIC Managers and Engineers
Be among the first to see how Generative AI is advancing hardware design workflows, providing solutions that reduce complexity and enable better results without steep learning curves. Witness how these tools offer immediate, practical benefits for real-world use cases. What You'll Learn: This session offers a unique opportunity to explore how Generative AI solutions with… From Concept to QoR: Practical Generative AI for ASIC Managers and Engineers
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CadenceTECHTALK: Driving Intelligent System Design with 3D-IC Multiphysics
As the industry reaches the limits of device scaling at advanced nodes, there is a growing demand for increased computing performance and data transfer in hyperscale data centers and AI designs. Advanced systems-on-chip (SoCs) are approaching the maximum size limits, and there is a need to find innovative solutions to continue scaling according to Moore's… CadenceTECHTALK: Driving Intelligent System Design with 3D-IC Multiphysics
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Accelerating SoC Automotive Design with Chiplets
Step into the forefront of innovation with our upcoming webinar, which explores how chiplet technology is revolutionizing the automotive industry and setting new benchmarks. Discover how Cadence is empowering customers to achieve unparalleled success with chiplets. Here's what you can look forward to: Mastering Chiplet Architecture: Dive into the intricacies of mastering chiplet architecture, where… Accelerating SoC Automotive Design with Chiplets
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Learn How to Utilize Victory Analytics and Machine Learning to Calibrate TCAD Data
Abstract Physics-based design using technology computer-aided design (TCAD) has provided fundamental contributions to R&D in the semiconductor industry. Traditionally, TCAD modeling is mostly developed manually by expert designers using a trial-and-error procedure. However, the imperative acceleration of time-to-market to reduce development expenses calls for renovation of these conventional TCAD approaches. Machine learning (ML) and artificial… Learn How to Utilize Victory Analytics and Machine Learning to Calibrate TCAD Data
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EDAPS 2024
Taj Yeshawantpur 2275 Tumkur Road, Yeshwantpur, Bangalore, IndiaThe IEEE Electrical Design of Advanced Packaging and Systems (EDAPS) symposium, a flagship event in the Asia-Pacific region, has consistently served as a platform for dissemmination of latest research in the areas of electrical design of chip, package and system. Designers and researchers across the world come forth to share and discuss their work on all… EDAPS 2024
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IEEE Asian Test Symposium 2024
Courtyard by Marriott, Ahmedabad Sindhu Bhawan Roa, Ahmedabad, IndiaThe Asian Test Symposium provides an international forum for engineers and researchers from all countries of the world, not just from Asia, to present and discuss various aspects of system, board and device testing with design, manufacturing and field considerations in mind. The 33th IEEE Asian Test Symposium (ATS 2024) December 17-20, 2024, Ahmedabad, Gujarat,… IEEE Asian Test Symposium 2024
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Advantages of using IP-XACT and TGI for SoC Development
Are you looking for ways to simplify your SoC development process, reduce rework, and accelerate time-to-market? Join us for an insightful webinar, "Advantages of using IP-XACT and TGI for SoC Development," where we’ll explore how the latest features of IP-XACT 2022 can revolutionize your SoC design workflows. What’s on the Agenda? Introduction to IP-XACT: A… Advantages of using IP-XACT and TGI for SoC Development
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Signal and Power Integrity Challenges in Advanced Packaging Technologies for Disaggregated Integration
Abstract The integrated circuit industry faces new challenges as chip complexity and area have been increasing to prohibitive ranges. Some segments have been adopting then a relatively new paradigm for heterogeneous integration based on chiplets at the first package level in combination with advanced 2.5 and 3D packaging technologies. The chiplet approach has the advantage… Signal and Power Integrity Challenges in Advanced Packaging Technologies for Disaggregated Integration
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38th International Conference on VLSI Design
The Leela Palace Bengaluru, IndiaInternational VLSI Design & Embedded Systems conference is a Premier Global conference with legacy of over three and half decades. This Global Annual technical conference that focusses on latest advancements in VLSI and Embedded Systems, is attended by over 2000 engineers, students & faculty, industry, academia, researchers, bureaucrats and government bodies. VLSI Design Conference started… 38th International Conference on VLSI Design
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CES 2025
Las Vegas Covention and World Trade Center 3150 Paradise Rd, Las Vegas, NV, United StatesThe world’s most powerful tech event is your place to experience the innovations transforming how we live. This is where global brands get business done, meet new partners and where the industry's sharpest minds take the stage to unveil their latest releases and boldest breakthroughs. Get a real feel for the latest solutions to the… CES 2025
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Silvaco UseRs Global Event – USA, 2025
Silvaco will hold its annual SURGE users event on January 15, 2025. SURGE brings the TCAD, EDA, and IP communities together to discuss new technologies, share users’ experiences, and discover innovative techniques for advanced semiconductor design. Everyone that registers will be entered into a drawing to win one of 2 pairs of Apple AirPods Pro 2.… Silvaco UseRs Global Event – USA, 2025
12 events found.