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DATE 2022
Design, Automation and Test in Europe Conference | The European Event for Electronic System Design & Test DATE conference is the main European event bringing together designers and design automation users, researchers and vendors, as well as specialists in the hardware and software design, test and manufacturing of electronic circuits and systems. DATE puts a… DATE 2022
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Memory Bandwidth Races Higher with HBM3
With the formal release of the HBM3 specification, memory bandwidth for AI/ML and HPC shifts to a higher gear. Terabytes of bandwidth are possible using HBM3’s 2.5D/3D architecture. Join memory expert Frank Ferro as he discusses what changes come with the new generation of HBM, and how the Rambus HBM3 memory subsystem can help designers… Memory Bandwidth Races Higher with HBM3
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Using ST Stellar MCU Virtual Prototypes to Deliver Next-Generation Software-Defined Vehicles
Automotive microcontrollers for next-generation software-defined vehicles need to deliver higher software capabilities. ST Stellar Integration MCUs offer safe, secure, and deterministic solutions for new vehicle architectures. The use of virtual prototypes is a key enabler to solving the emerging, complex software development challenges throughout the automotive design and test supply chain, such as feature integration,… Using ST Stellar MCU Virtual Prototypes to Deliver Next-Generation Software-Defined Vehicles
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Analog Fault Injection Simplifies ISO 26262 Compliance
As the automotive market moves toward electrified drivetrains and autonomous driving systems, chip makers increasingly need to design integrated mixed-signal chips that meet the ISO 26262 automotive certification. With these complex designs, designers will require automation to overcome the limits of using expert judgment to ensure compliance. Integrating functional safety analysis into their existing design… Analog Fault Injection Simplifies ISO 26262 Compliance
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How Silvaco TCAD is at the Heart of Innovation in RF Devices
At high frequency, the accurate modeling of parasitic elements is crucial to IC design. Substrate behavior is a significant contributor to such parasitics, and its modelling is a challenge, not only under small-signal conditions due to strongly non-uniform resistivity profiles in semiconductor materials, but especially under large-amplitude excitations. In this work, Silvaco’s TCAD Victory Device… How Silvaco TCAD is at the Heart of Innovation in RF Devices
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What’s New in Clarity 2022.1
The Cadence® Clarity™ 3D Solver, utilized by scores of customers across the globe, continues to accelerate design flows for leading companies in industries such as medical, hyperscale computing, 5G, automotive, and industrial internet of things (IIoT). The latest 2022.1 release continues to widen the gap between the Clarity 3D finite element (FEM) solver and alternatives in both… What’s New in Clarity 2022.1
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GOMACTech 2022
Hyatt Regecy Miami 400 South East Second Avenue, Miami, FL, United StatesWELCOME TO GOMACTech 2022 Enabling Distributed Capabilities: Microelectronics Thriving in the Face of Change GOMACTech was established primarily to review developments in microcircuit applications for government systems. Established in 1968, the conference has focused on advances in systems being developed by the Department of Defense and other government agencies and has been used to announce… GOMACTech 2022
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SecuryzrTM integrated Security Services Platform (iSSP): Services for lifecycle security management
Nowadays, fleets of connected devices have operational needs to maintain over time a relevant level of security. To mitigate the growing threats and vulnerabilities in the field and protect end-user devices from cyberattacks at both the network and device levels, a new strategy is needed to filter attacks in real time and implement a centralized… SecuryzrTM integrated Security Services Platform (iSSP): Services for lifecycle security management
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CadenceTECHTALK: 3D-IC Chip-Centric Power and Thermal Integrity with High-Performance Hierarchical Analysis
A 3D-IC includes the package, interposer, multiple chiplets, through-silicon vias (TSVs), and through-dielectric vias (TDVs). Supplying power to the chiplets and dissipating heat through these various components poses a major power integrity (PI) and thermal integrity challenge. Early analysis is extremely critical in 3D-ICs, since changing the die stack up later in the design process… CadenceTECHTALK: 3D-IC Chip-Centric Power and Thermal Integrity with High-Performance Hierarchical Analysis
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Synopsys CAD Navigation Users Group Meeting: Avalon & SysNav FA Solutions
Synopsys would like to invite you to the 4th annual, and 2nd virtual, Synopsys CAD Navigation Users Group to be held in March 2022. Date & Time: Thursday, March 24, 2022. 07:00 a.m. – 09:00 a.m. PT Venue Details: Virtual Conference We have planned an exciting event with presentations from a diverse group of CADNav… Synopsys CAD Navigation Users Group Meeting: Avalon & SysNav FA Solutions
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Learn How mqSemi AG Developed 3D Power Devices Proof of Concept with Silvaco TCAD Simulations
Silicon IGBT and SiC MOSFETs are today's key power semiconductor switches for many power electronics converters such as those in automotive, renewables and industrial applications. Both device concepts continue to evolve, and development trends are continuously targeting improved overall electrical and reliability performance at lower costs. In addition to established power device manufacturers, many start-up… Learn How mqSemi AG Developed 3D Power Devices Proof of Concept with Silvaco TCAD Simulations
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IRPS 2022
Hilton DFW Lakes Executive Conference Center 1800 Highway 26E, Grapevine, TX, United StatesFor 60 years, IRPS has been the premiere conference for engineers and scientists to present new and original work in the area of microelectronics reliability. Drawing participants from the United States, Europe, Asia, and all other parts of the world. The 2022 IEEE IRPS will be presented as an in-person conference with a virtual component.… IRPS 2022
12 events found.