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Advancements in memory technology are fueling rapid growth in big data applications across AI, 5G, Automotive, and HPC. These demanding applications create many challenges for memory designers. Some long-standing challenges are exacerbated, while the latest technology nodes have introduced some new ones. At Synopsys, there is a corporate-wide commitment to developing broad-based solutions that address these challenges. … Memory Users Conference 2024
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ME-Pro™ is a unified tool for designers, process developers, modeling engineers, and PDK engineer providing robust simulation and analysis capabilities for semiconductor device model verification and evaluation. This comprehensive platform supports evaluation across device, circuit, and process domains enabling interactive development and offering critical feedback for process improvements. With decades of Primarius’ expertise, ME-Pro™ features… Interactive SPICE Model Verification Platform ME-Pro |
2 events,
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Advancements in memory technology are fueling rapid growth in big data applications across AI, 5G, Automotive, and HPC. These demanding applications create many challenges for memory designers. Some long-standing challenges are exacerbated, while the latest technology nodes have introduced some new ones. At Synopsys, there is a corporate-wide commitment to developing broad-based solutions that address these challenges. … Memory Users Conference 2024 – China, Taiwan
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The Arm platform is providing the foundation for the next wave of AI smartphones and laptops. As AI models rapidly evolve, we’re seeing that software begins to outpace hardware, requiring additional innovation at all levels of the compute stack. To meet these growing demands, the Arm platform offers a new compute solution for maximum performance… Redefining Mobile Experiences with AI – Session 2 |
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EDPS 2024 is now taking shape. The place to be is once again SEMI, in Milpitas, and the dates are Thursday and Friday, Oct 3rd and 4th, 2024. Registration is now open: https://2024-ieee-edps.eventbrite.com. Who needs to register? Please see the Registration page. Talks from EDPS 2023 and the last 24 years of EDPS, are are available and… Electronic Design Process Symposium (EDPS) – 2024
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Register for the Synopsys VC Formal Special Interest Group (SIG) event today. This event provides an opportunity for users, managers, and enthusiasts to stay connected with the latest formal verification innovations, techniques and methodologies. Industry leaders such as Amazon, Black Sesame, Microsoft, NVIDIA, Samsung, and Untether AI will share their experiences with the latest formal… VC Formal Special Interest Group
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Join us at this year’s Synopsys Signoff SIG (Special Interest Group) event. Signoff is a critical quality control checkpoint in the chip development process, but design complexity and advance process nodes are pushing the boundaries of what is expected of signoff solutions. Meeting these scaling challenges is becoming more difficult. At this year’s Synopsys Signoff… Signoff Special Interest Group |
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For more than 30 years PCB West has trained designers, engineers, fabricators and, lately, assemblers on making printed circuit boards for every product or use imaginable. More than 2,000 designers, fabricators, assemblers and engineers register and more than 100 companies exhibit each year at the four-day technical conference and one-day sold-out exhibition. From high-reliability military/aerospace… PCB West 2024 
Join us as we embark on an exciting new journey in the vibrant city of Barcelona! From 8-10 October 2024, we will unite the AutoSens community at the Palau de Congressos in Barcelona to shape the future of ADAS and AV. Expect over 60 expert speakers, engaging panels, technical case studies, and exploration of 12… AutoSens Europe 2024
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Accelerating DFT verification sign-off with the Questa DFT Verification Platform This seminar will update you on technologies and techniques you can adopt to increase your DFT verification productivity today. Specifically, we will cover: Navigating the Growing Complexity of Design-for-Test and Evolving Verification Challenges Revolutionizing Test Strategies to deliver reliable products into HPC, Automotive, Aerospace,… Accelerating DFT verification sign-off with the Questa DFT Verification Platform
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Cocotb 2.0 is the latest major version of cocotb, ironing out many quirks that have accumulated over the years. With only small changes to your testbenches, you can benefit from improved typing and less surprising corner cases. In this talk, we’ll show what’s new in cocotb 2.0, and how you can modernize your code bases… Cocotb 2.0: Modernize your testbenches for even more productivity |
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Abstract: SystemVerilog is a super next-generation Verilog with a fancy marketing name. SystemVerilog leveraged many of its features from other languages and methodologies. Class-based capabilities, constrained random testing (CRT), and functional coverage were all features that were added to SystemVerilog and incorporated into the Universal Verification Methodology (UVM). UVM has become the most dominant and… The Development and Evolution of Verilog & SystemVerilog |
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The Design and Verification Conference in Europe (DVCon Europe) is the leading European event covering the application of languages, tools, and intellectual property for the design and verification of electronic systems and integrated circuits. Sponsored by Accellera Systems Initiative, DVCon Europe brings chip architects, design and verification engineers, and IP integrators the latest methodologies, techniques,… DVCon Europe 2024 
The OCP Summit is the premier event uniting the most forward-thinking minds in open IT Ecosystem development. The Summit presents a unique platform for our Community from around the globe to share their insights, foster partnerships and showcase cutting-edge advancements in open hardware and software. The 2024 OCP Global Summit theme is "From Ideas to Impact". This… 2024 OCP Global Summit
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There are so many options for Network-on-Chip: ARM-Corelink CMN700, Arteris FlexNoC, open-source NoC interconnect, and of course developing home-grown fully customized solutions. Where does each solution fit? Where do we use it- backplane vs inside domains? How does AMBA AXI or PCIe or CXL fit in the mix? With the advent of chiplet, do we… ARM corelink, Arteris NoC, UCIe, Bunch-of-wires, CXL and PCIe- Designing the interconnect is not for the weak-hearted |
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Elevate your success with osmosis 2024 The annual osmosis event is a dynamic platform for exchanging successes achieved through applying formal techniques to overcome verification challenges. It offers a unique opportunity to connect and engage with our accomplished research and development (R&D) experts and participants. If you possess a compelling achievement narrative, we invite you… OSMOSIS 2024
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The AXI4 Stream protocol is used as a standard interface to exchange data between connected IPs within FPGA designs. For crossing clock domains, the AXI4 Stream interconnect is based on switches capable of transferring data to another asynchronous clock domain. The alternative solution is a dual-port AXI4 Stream IP, capable of changing clock domains when… Static and Dynamic CDC Verification of AXI4 Stream-based IPs |
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The CadenceCONNECT: Jasper User Group San Jose will be held in person on October 22 - 23 at the Cadence San Jose campus. This interactive, in-depth technical conference connects designers, verification engineers, and engineering managers from around the world to share the latest design and verification practices based on Cadence’s Jasper formal verification technologies and… Jasper User Group San Jose 2024 
RISC-V is defining the future of open computing by providing unprecedented freedom to innovate. More than 13 billion RISC-V cores have shipped, powering new innovations in AI/ML, wireless, automotive. data center, space, IoT, embedded and more. Each day, thousands of engineers around the world collaborate and contribute to advance RISC-V. The RISC-V community shares the… RISC-V Summit – North America 2024 |
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VirtuaLAB protocol solutions offer a full-stack testing environment with seamless connectivity and stimulus traffic generation for designs under test. It operates autonomously, adapting to scenarios without requiring protocol knowledge from the user. VirtuaLAB significantly reduces test and compliance suite regression times, running at high emulation speeds, integrated with Protocol Analyzer for complete protocol visibility and… Hardware Verification using VirtuaLAB |
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Learn About: Latest updates on TSMC 3DFabric™ chip stacking and advanced packaging processes, InFO, CoWoS®, and SoIC, 3DFabric Alliance, and 3Dblox™ standard, plus innovative 3Dblox-based design enablement technologies and solutions, targeting HPC, AI/ML, and mobile applications Comprehensive design solutions for specialty technologies enabling ultra-low power, ultra-low voltage, analog migration, RF, mmWave, and automotive designs targeting… TSMC OIP Ecosystem Forum Japan 2024 |
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The International Conference on Computer-Aided Design focuses on advancements and research in the field of electronic design automation (EDA) and computer-aided design (CAD) for integrated circuits and systems. Topics include innovations in design methodologies, tools, algorithms, and technologies related to the development of electronic systems. The International Conference on Computer-Aided Design focuses on advancements and… ICCAD 2024 |
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High Bandwidth Memory (HBM) has revolutionized AI, machine learning, and High-Performance Computing by significantly increasing data transfer speeds and alleviating performance bottlenecks. The introduction of next-generation HBM4 is especially transformative, enabling faster training and execution of complex AI models. JEDEC has announced that the HBM4 specification is nearing finalization. In this webinar, you will learn how… Verifying the next generation High Bandwidth Memory controllers for AI and HPC applications |
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