Cadence
DVClub Europe – Performance Testing and Analysis
Discuss the performance verification challenges posed by complex SoC with distributed cache from cluster, to interconnect to die-to-die. Agenda (BST) 12:00 Welcome and Introduction – Mike Bartley, Tessolve 12:00 Nick Heaton, Cadence Design Systems - SoC Verification in a Multi-chip, Multi-die world 12:30 TBD 13:00 TBD 13:30 Close Additional Information For additional information please visit… DVClub Europe – Performance Testing and Analysis
CadenceTECHTALK: System-Level Thermal Signoff from Chips Through to Racks
Today’s modern electronic designs require ever more functionality and performance to meet consumer demand. These challenges become more critical and complex when resistive losses in PCB and package structures are significant since resistive losses are temperature dependent. In this webinar, we will look at an electrothermal co-simulation solution for the full hierarchy of electronic systems… CadenceTECHTALK: System-Level Thermal Signoff from Chips Through to Racks
Design Robust IC Packages Faster Using In-Design SI/PI Analysis
IC package design teams and characterization teams have had a “throw-it-over-the-wall” relationship for decades, which often delays design releases by months. However, as signal integrity (SI) and power integrity (PI) challenges evolve with multi-die heterogeneous integration, the need to perform SI/PI analysis as part of the design flow has become a requirement to meet compressed… Design Robust IC Packages Faster Using In-Design SI/PI Analysis
ChipEx 2023
Hilton Hotel Tel-aviv HaYarkon St 205, Tel aviv, IsraelThe major annual event of the Israeli semiconductor industry ChipEx2023, the largest annual event of the Israeli semiconductor industry, will be held on May 9, 2023 in Tel Aviv, Israel. ChipEx2023 showcases companies including manufacturers, developers and suppliers of advanced hardware technologies & services. It also includes a technical seminar where the world's leading experts address the industry's most relevant… ChipEx 2023
The 32nd Microelectronics Design and Test Symposium (MDTS 2023)
Crowne Plaza - Desmond Hotel 660 Albany Shaker Rd, Albany, NY, United StatesTheme Artificial Intelligence, Machine Learning, and Deep Learning: Tactical and Strategic Impacts to Microelectronics Design and Test About MDTS 2023 The IEEE Microelectronics Design & Test Symposium (MDTS) provides a forum for academic and industry researchers and engineers to discuss the latest advances in microelectronics, share their visions in modern microelectronic technologies, and foster academic-industry… The 32nd Microelectronics Design and Test Symposium (MDTS 2023)
ITF World 2023
Flanders Meeting & Convention Center Antwerp Antwerp, BelgiumImec’s flagship event on semiconductor advances & deep-tech solutions formerly known as Future Summits. Semiconductors have become increasingly instrumental – and often even dominant – for the future of industries and application domains worldwide. For many decades, imec has played a major role in the global semiconductor industry. Our expertise and partnerships now also progress… ITF World 2023
Experience the Future of Custom Design with Virtuoso Studio
Radisson Blu Outer King Road, Bengaluru, IndiaWith design boundaries constantly stretched and redefined, traditional borders for “custom design” no longer hold. Creative and intelligent solutions are imperative for boosting overall design, simulation, layout, and verification productivity through ever-changing specifications. Join us for this full-day in-person seminar to learn how Cadence is leveraging its expertise to revolutionize custom design on all fronts… Experience the Future of Custom Design with Virtuoso Studio
Passive Component Synthesis and Optimization for IC Designs
Join us at this webinar to learn more about the Cadence® EMX® Designer, our newly introduced passive component synthesis and optimization solution. In split seconds, the EMX Designer generates very flexible DRC-clean parametric cells of passive devices, such as inductors, transformers, and T-coils. Leveraging the EMX Planar 3D Solver, the industry’s gold-standard electromagnetic modeling engine,… Passive Component Synthesis and Optimization for IC Designs
ISCAS 2023
Monterey, CA Monterey, CA, United StatesThe IEEE International Symposium on Circuits and Systems (ISCAS) is the flagship conference of the IEEE Circuits and Systems (CAS) Society and the world’s premiere forum for researchers in the active fields of theory, design and implementation of circuits and systems. Keynote Speakers Dr. Margaret Martonosi Margaret Martonosi is the US National Science Foundation’s (NSF)… ISCAS 2023
Embedded Vision Summit 2023
Santa Clara Convention Center 5001 Great America Parkway, Santa Clara, CA, United StatesThe Summit attracts a global audience of technology professionals from companies developing computer vision and edge AI-enabled products including embedded systems, cloud solutions and mobile applications. Why attend? It's a First-Rate Program with Powerful Insights into Practical Perceptual AI. Join us for four days of learning—from tutorials to deep-dive days, covering the latest technical insights,… Embedded Vision Summit 2023
STAC Summit
New York Marriott Marquis 1535 Broadway, New York City, NY, United StatesSTAC Summits bring together CTOs and other industry leaders responsible for solution architecture, infrastructure engineering, application development, machine learning/deep learning engineering, data engineering, and operational intelligence to discuss important technical challenges in trading and investment.
Xcelium: The Key to Unlocking Unmatched Mixed-Signal Performance
Xcelium mixed-signal simulation enables teams to achieve digital simulation speeds of analog models and opens mixed-signal designs to advanced verification techniques typically applied within standard verification flows. Built on a SystemVerilog Real Number Modeling (RNM) foundation, Xcelium automates the signal integration of digital and RNM code to achieve digital simulation speeds for mixed-signal designs. This… Xcelium: The Key to Unlocking Unmatched Mixed-Signal Performance