Intel
Hot Chips 2023
Stanford University 471 Lagunita Drive, Stanford, CA, United StatesHot Chips 2023 (advance program) will be held as a hybrid conference with in-person attendance at Stanford University from August 27 to 29, 2023. Conference Format Hot Chips 2023 will… Read More »Hot Chips 2023
Accelerating Mainstream Adoption of Multi-Die Systems
Synopsys recently hosted a panel discussion with Ansys, Bosch, Intel, and Samsung to share their insights on the rapid adoption of multi-die systems. We invite you to the public broadcast… Read More »Accelerating Mainstream Adoption of Multi-Die Systems
FPGAworld Conference 2023 – Stockholm
ÅF Frösundaleden 2A, 169 70 Solna, SwedenThe FPGAworld Conference is an international forum for researchers, engineers, teachers, students, and hackers. It covers topics such as complex analog/digital/software FPGA SoC systems, FPGA/ASIC-based products, educational & industrial cases,… Read More »FPGAworld Conference 2023 – Stockholm
SystemC Evolution Fika
The SystemC Evolution Fika is a series of online workshops to discuss the latest SystemC developments and applications. We refer to these workshops as fikas, to honor the fika tradition of… Read More »SystemC Evolution Fika
FPGAworld Conference 2023 – Copenhagen
DTU Science Park 2800 Kongens, Lyngby, DenmarkThe FPGAworld Conference is an international forum for researchers, engineers, teachers, students, and hackers. It covers topics such as complex analog/digital/software FPGA SoC systems, FPGA/ASIC-based products, educational & industrial cases,… Read More »FPGAworld Conference 2023 – Copenhagen
EDPS 2023
Synopsys Building 1 800 North Mary Avenue, Sunnyvale, CA, United StatesEDPS 2023 is approaching fast! The program is firming up - please see the program page for a preliminary list of talks. REGISTRATION IS NOW OPEN. Everyone, including speakers, must register. 2023-ieee-edps.eventbrite.com… Read More »EDPS 2023
The UCIe™ 1.1 Specification: Future Applications of Chiplets
Presenter: Dr. Debendra Das Sharma, UCIe Consortium Chairman and Intel Senior Fellow, Chief Architect of I/O Technology and Standards at Intel The UCIe™ (Universal Chiplet Interconnect Express™) 1.1 Specification was released… Read More »The UCIe™ 1.1 Specification: Future Applications of Chiplets
IESA AI Summit
Trident Hotel Hyderabad Hyderabad, IndiaExperience the unprecedented growth opportunities in the semiconductor and electronics industry, fueled by rapid advancements in Artificial Intelligence (AI). Embrace the paradigm shift from software-centric approaches to hardware-centric solutions, captivating… Read More »IESA AI Summit
Tackling Challenges in 3D Heterogenous Integrated (3DHI) Microelectronics for Aerospace, Government, and Defense Systems
Join industry experts from aerospace, government, and defense as they discuss the complexities of 3D Heterogeneous Integration (3DHI), highlighting some of the technological, manufacturing, and economic complexities as well as… Read More »Tackling Challenges in 3D Heterogenous Integrated (3DHI) Microelectronics for Aerospace, Government, and Defense Systems
FPGA Frontrunner Meet & Greet
Thales 350 Longwater Avenue, Reading, United KingdomThe FPGA Front Runners event will be hosted by Thales at their venue in Reading. The event will focus on “Security at System Level, and what security features we need… Read More »FPGA Frontrunner Meet & Greet
Innovative Designs Enabled by Ansys Solutions – IDEAS 2023
ANSYS’ VIRTUAL USER CONFERENCE FOR ELECTRONICS, SEMICONDUCTORS AND PHOTONICS DESIGNERS Join us for the IDEAS Digital Forum — a place to catch up on industry best practices and the latest… Read More »Innovative Designs Enabled by Ansys Solutions – IDEAS 2023
CES 2024
Las Vegas Covention and World Trade Center 3150 Paradise Rd, Las Vegas, NV, United StatesRegistration is now open for CES® 2024 — taking place Jan. 9-12, in Las Vegas. Flip the switch on global business opportunity with CES, where you can meet with partners, customers, media, investors, and… Read More »CES 2024