Step into the forefront of innovation with our upcoming webinar, which explores how chiplet technology is revolutionizing the automotive industry and setting new benchmarks. Discover… Read More »Accelerating SoC Automotive Design with Chiplets
As the industry reaches the limits of device scaling at advanced nodes, there is a growing demand for increased computing performance and data transfer in… Read More »CadenceTECHTALK: Driving Intelligent System Design with 3D-IC Multiphysics
Power network design and analysis of 3D-ICs is a major challenge because of the complex nature and large size of the power network. In addition,… Read More »Addressing 3D-IC Power Integrity Design Challenges
3D IC (2.5D/3D) designs are on the rise. Design for Test (DFT) for chiplets must be general purpose so they can be tested stand alone… Read More »DFT for chiplets & 3D ICs using Tessent Multi-die
From fintech to automotive, defense to healthcare, everyone wants bespoke computing platforms to build “software-defined solutions” that are differentiated in their respective markets. Sign up… Read More »The Era of Software-Defined Everything: Chiplets and Bespoke Silicon
Join us on July 20th; Ansys R&D members will discuss an overview of the 3D-IC technology development frameworks offered by TSMC, Samsung, and Intel and… Read More »3D-IC Foundry Frameworks
Our upcoming CadenceTECHTALK: Solution for 3D-IC Interposer Signal Integrity is designed to teach engineers to translate a GDSII stream format (GDSII) file and partition it… Read More »Solution for 3D-IC Interposer Signal Integrity
Join us on May 17 for the latest 3D-IC webinar series, “Power Integrity Challenges and Solutions for Interposer Design.” The discussion will focus on interposer… Read More »Power Integrity Issues and Solutions for Silicon Interposers
About Siemens Tessent DFT Forum 2023 India Presenting silicon lifecycle solutions from Siemens EDA: Engineering a smarter future faster Join us for the Siemens Tessent… Read More »Siemens Tessent DFT Forum 2023 India
In this latest installment of the year-long 3D-IC webinar series, Dr. Lang Lin will discuss the Thermal Integrity issues associated with 3D-IC designs. The presentation… Read More »Thermal Integrity Challenges and Solutions of Silicon Interposer Design