Abstract The integrated circuit industry faces new challenges as chip complexity and area have been increasing to prohibitive ranges. Some segments have been adopting then a relatively new paradigm for heterogeneous integration based on chiplets… Signal and Power Integrity Challenges in Advanced Packaging Technologies for Disaggregated Integration
Step into the forefront of innovation with our upcoming webinar, which explores how chiplet technology is revolutionizing the automotive industry and setting new benchmarks. Discover how Cadence is empowering customers to achieve unparalleled success with… Accelerating SoC Automotive Design with Chiplets
As the industry reaches the limits of device scaling at advanced nodes, there is a growing demand for increased computing performance and data transfer in hyperscale data centers and AI designs. Advanced systems-on-chip (SoCs) are… CadenceTECHTALK: Driving Intelligent System Design with 3D-IC Multiphysics
Power network design and analysis of 3D-ICs is a major challenge because of the complex nature and large size of the power network. In addition, designers must deal with the complexity of routing power through… Addressing 3D-IC Power Integrity Design Challenges
3D IC (2.5D/3D) designs are on the rise. Design for Test (DFT) for chiplets must be general purpose so they can be tested stand alone and easy to test after assembly into 2.5D or 3D… DFT for chiplets & 3D ICs using Tessent Multi-die
From fintech to automotive, defense to healthcare, everyone wants bespoke computing platforms to build “software-defined solutions” that are differentiated in their respective markets. Sign up and save your spot for this special presentation. Overview With… The Era of Software-Defined Everything: Chiplets and Bespoke Silicon
Join us on July 20th; Ansys R&D members will discuss an overview of the 3D-IC technology development frameworks offered by TSMC, Samsung, and Intel and how Ansys simulation tools and workflows fit into those frameworks.… 3D-IC Foundry Frameworks
Our upcoming CadenceTECHTALK: Solution for 3D-IC Interposer Signal Integrity is designed to teach engineers to translate a GDSII stream format (GDSII) file and partition it into simulation blocks for the Clarity 3D field solver. First,… Solution for 3D-IC Interposer Signal Integrity
Join us on May 17 for the latest 3D-IC webinar series, “Power Integrity Challenges and Solutions for Interposer Design.” The discussion will focus on interposer power analysis as an isolated case and in context with… Power Integrity Issues and Solutions for Silicon Interposers
About Siemens Tessent DFT Forum 2023 India Presenting silicon lifecycle solutions from Siemens EDA: Engineering a smarter future faster Join us for the Siemens Tessent Design-for-Test (DFT) India Tech Forum, being held in Hotel Radisson Blu,… Siemens Tessent DFT Forum 2023 India