System planning is a major part of multi-chiplet design. Whether it’s a 2.5-D configuration with an interposer or full-stacked 3D design mounted on a package,… Read More »CadenceTECHTALK: System Planning and Implementation for Different 3D-IC Design Styles
Multi-chiplet design and packaging introduces extra design and analysis requirements like system planning, bump alignment, TSV and micro-bump insertion and extraction, electrothermal analysis, cross-die STA,… Read More »CadenceTECHTALK: Efficient Multi-Chiplet Design with Integrity 3D-IC Unified Platform
IEEE International 3D System Integration Conference (3DIC) November 15-18, 2021 Raleigh, North Carolina, USA After a one-year hiatus, 3DIC will once again unite 2.5D/3D researchers… Read More »3DIC 2021