CadenceTECHTALK: Overcoming System-Level 3D-IC Electrical and Thermal Challenges
Electronic products with 3D-ICs face growing system challenges related to signal, power, and thermal integrity. Design density can lead to performance issues caused by heat, crosstalk, and power noise. In this session, we will address… CadenceTECHTALK: Overcoming System-Level 3D-IC Electrical and Thermal Challenges