AI Hardware & Edge AI Summit
The combined AI Hardware & Edge AI Summit comprehensively covers the design and deployment of ML hardware and software infrastructure across the cloud-edge continuum. For… Read More »AI Hardware & Edge AI Summit
Cadence
Passive Component Synthesis and Optimization for IC Designs
Join us at this webinar to learn more about the Cadence® EMX® Designer, our newly introduced passive component synthesis and optimization solution. In split seconds,… Read More »Passive Component Synthesis and Optimization for IC Designs
Design Robust IC Packages Faster Using In-Design SI/PI Analysis
IC package design teams and characterization teams have had a “throw-it-over-the-wall” relationship for decades, which often delays design releases by months. However, as signal integrity… Read More »Design Robust IC Packages Faster Using In-Design SI/PI Analysis
ITF World 2023
Imec’s flagship event on semiconductor advances & deep-tech solutions formerly known as Future Summits. Semiconductors have become increasingly instrumental – and often even dominant –… Read More »ITF World 2023
DVCon Taiwan 2023
The Design & Verification Conference & Exhibition is the premier conference on the application of languages, tools, methodologies and standards for the design and verification… Read More »DVCon Taiwan 2023
Embedded Vision Summit 2023
The Summit attracts a global audience of technology professionals from companies developing computer vision and edge AI-enabled products including embedded systems, cloud solutions and mobile… Read More »Embedded Vision Summit 2023
ChipEx 2023
The major annual event of the Israeli semiconductor industry ChipEx2023, the largest annual event of the Israeli semiconductor industry, will be held on May 9, 2023 in Tel… Read More »ChipEx 2023
CadenceTECHTALK: System-Level Thermal Signoff from Chips Through to Racks
Today’s modern electronic designs require ever more functionality and performance to meet consumer demand. These challenges become more critical and complex when resistive losses in… Read More »CadenceTECHTALK: System-Level Thermal Signoff from Chips Through to Racks
DVClub Europe – Performance Testing and Analysis
Discuss the performance verification challenges posed by complex SoC with distributed cache from cluster, to interconnect to die-to-die. Agenda (BST) 12:00 Welcome and Introduction –… Read More »DVClub Europe – Performance Testing and Analysis
IEEE 30th International Conference on Electronics, Circuits and Systems (ICECS)
The IEEE 30th International Conference on Electronics, Circuits and Systems (ICECS) will be held in Istanbul, Turkey 4-7 December 2023. As the flagship conference of… Read More »IEEE 30th International Conference on Electronics, Circuits and Systems (ICECS)