With the growing complexities of 3D-ICs, chiplets, advanced packaging, and high-performance boards, engineers need a unified solution that provides early insight and analysis to detect… Read More »Shift-Left Thermal Analysis with AI-Enabled Celsius Studio Platform
Today’s modern electronic designs require ever more functionality and performance to meet consumer demand. These challenges become more critical and complex when resistive losses in… Read More »System-Level Thermal Signoff from Chips Through to Racks
The heterogeneous integration of chips and chiplets in IC packages is all the rage as we face “More than Moore” performance challenges. While these innovative… Read More »Proactively Address Thermal Concerns in Advanced IC Packages
SEMI-THERM is an international symposium dedicated to the thermal management and characterization of electronic components and systems. SEMI-THERM provides knowledge covering all thermal scales from… Read More »SEMI-THERM
The Cadence® AWR® V16 for RF Design Excellence Webinar Series introduces the latest capabilities in Cadence® AWR Design Environment® Version 16 (V16), providing ready access… Read More »Advanced Antenna Design and Integration Through Circuit/EM Co-Simulation
Overview The Cadence® Celsius™ Thermal Solver is now integrated with the Cadence AWR Design Environment® V16 platform, supporting electrothermal analysis for MMIC/RFIC, PCB, and module designs.… Read More »Thermal Analysis for MMIC and RF PCB Power Applications