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Celsius

Cadence, October 18, 2023

System-Level Thermal Signoff from Chips Through to Racks

Today’s modern electronic designs require ever more functionality and performance to meet consumer demand. These challenges become more critical and complex when resistive losses in… Read More »System-Level Thermal Signoff from Chips Through to Racks

Cadence October 19

Advanced Antenna Design and Integration Through Circuit/EM Co-Simulation

The Cadence® AWR® V16 for RF Design Excellence Webinar Series introduces the latest capabilities in Cadence® AWR Design Environment® Version 16 (V16), providing ready access… Read More »Advanced Antenna Design and Integration Through Circuit/EM Co-Simulation

Thermal Analysis

Thermal Analysis for MMIC and RF PCB Power Applications

Overview The Cadence® Celsius™ Thermal Solver is now integrated with the Cadence AWR Design Environment® V16 platform, supporting electrothermal analysis for MMIC/RFIC, PCB, and module designs.… Read More »Thermal Analysis for MMIC and RF PCB Power Applications