Designing PCBs in today’s world means using multiple tools to get the job done. The Allegro X Design Platform allows you to access all these tools in one unified design environment. Join us to discuss…
Thermal stress analysis plays a crucial role in the design and performance optimization of packaging materials and boards, especially in industries where temperature variations are significant. This webinar presents a comprehensive overview of recent developments…
With the growing complexities of 3D-ICs, chiplets, advanced packaging, and high-performance boards, engineers need a unified solution that provides early insight and analysis to detect and correct design problems before it is too late. This…
Today’s modern electronic designs require ever more functionality and performance to meet consumer demand. These challenges become more critical and complex when resistive losses in PCB and package structures are significant since resistive losses are…
The heterogeneous integration of chips and chiplets in IC packages is all the rage as we face “More than Moore” performance challenges. While these innovative design practices successfully address performance goals, some design teams find…
SEMI-THERM is an international symposium dedicated to the thermal management and characterization of electronic components and systems. SEMI-THERM provides knowledge covering all thermal scales from integrated circuits to facilities, fosters discussions between thermal engineers, professionals,…
The Cadence® AWR® V16 for RF Design Excellence Webinar Series introduces the latest capabilities in Cadence® AWR Design Environment® Version 16 (V16), providing ready access to Cadence Clarity™ 3D Solver and Celsius™ Thermal Solver for…
Overview The Cadence® Celsius™ Thermal Solver is now integrated with the Cadence AWR Design Environment® V16 platform, supporting electrothermal analysis for MMIC/RFIC, PCB, and module designs. Thermal analysis provides RF circuit designers with insight regarding operating…