Overview This seminar will update you on technologies and techniques you can adopt to increase your verification productivity today. Specifically, we will cover: How the new AI/ML paradigm shift across the industry is enabling functional…
Accelerating DFT verification sign-off with the Questa DFT Verification Platform This seminar will update you on technologies and techniques you can adopt to increase your DFT verification productivity today. Specifically, we will cover: Navigating…
Manufacturing issues can be a big reason why your project timelines get derailed and even result in costly failures. By understanding common errors that occur while designing or creating your fabrication and assembly documentation, you…
User2User is the perfect opportunity to learn, share and network with fellow technical experts who design leading-edge products using Siemens EDA tools. Dedicated to end-users of Siemens EDA solutions, this conference is free to attend…
Combining market-leading design-for-test (DFT) technologies with best-in-class netlist synthesis allows you to achieve DFT success more quickly. Many customers, including those for emulation and IC test, have challenges with scaling architectures. This webinar describes how…
3D IC (2.5D/3D) designs are on the rise. Design for Test (DFT) for chiplets must be general purpose so they can be tested stand alone and easy to test after assembly into 2.5D or 3D…
System-on-Chip (SoC) designs continue to grow in both size and complexity in order to meet the ever-growing performance and power demands associated with modern technology. To keep up with this fast-paced evolution, the corresponding design-for-test…
As designs get increasingly complex, design teams are looking to find bugs earlier, to reduce rework and shorten time-to-market. The ultimate “shift left” is to put easy-to-use static verification in the hands of RTL designers…
About Siemens Tessent DFT Forum 2023 India Presenting silicon lifecycle solutions from Siemens EDA: Engineering a smarter future faster Join us for the Siemens Tessent Design-for-Test (DFT) India Tech Forum, being held in Hotel Radisson Blu,…
In the era of more-than-Moore’s law, chip makers are scaling by adopting complex architectures that connect dies vertically (3D IC) or side-by-side (2.5D). There has been progress throughout the semiconductor ecosystem in bringing 2.5D and…