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Cadence, July 13, 2023

Comprehensive Static Verification for FPGA and ASIC RTL Designers

As designs get increasingly complex, design teams are looking to find bugs earlier, to reduce rework and shorten time-to-market. The ultimate “shift left” is to… Read More »Comprehensive Static Verification for FPGA and ASIC RTL Designers

Tessent, February 9, 2023

Implementing DFT in 2.5/3D designs using Tessent Multi-die software

In the era of more-than-Moore’s law, chip makers are scaling by adopting complex architectures that connect dies vertically (3D IC) or side-by-side (2.5D). There has… Read More »Implementing DFT in 2.5/3D designs using Tessent Multi-die software

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