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Siemens EDA

Siemens, December 7, 2023

Multi-Die System Verification with Siemens Avery UCIe VIP

Conventional monolithic SoCs are becoming a bottleneck for power, performance, and area (PPA), creating limitations for Data-intensive applications like high-performance computing (HPC), machine learning (ML)… Read More »Multi-Die System Verification with Siemens Avery UCIe VIP

Siemens, November 16, 2023

Boost SoC debug and analytics with embedded software and smart monitors

On-chip monitors and debug structures can dramatically simplify debug, validation, analytics, and optimization of complex SoCs. Such monitors are often accessed by software executing on… Read More »Boost SoC debug and analytics with embedded software and smart monitors

TSMC 2023

TSMC 2023 North America OIP Ecosystem Forum

Learn About: Emerging advanced node design challenges and corresponding design flows and methodologies for N2, N3/N3E/N3P/N3AE, N4/N4P, N5/N5A, N6/N6e/N6RF/N7, N12e, and N22 Latest updates on… Read More »TSMC 2023 North America OIP Ecosystem Forum