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Siemens, October 23, 2024

Hardware Verification using VirtuaLAB

VirtuaLAB protocol solutions offer a full-stack testing environment with seamless connectivity and stimulus traffic generation for designs under test. It operates autonomously, adapting to scenarios without requiring protocol knowledge from the user. VirtuaLAB significantly reduces… 

TSMC OIP 2024

TSMC North America OIP Ecosystem Forum 2024

Learn About: Emerging advanced node design challenges and corresponding design flows and methodologies for A16, N2 and N3 processes Latest updates on TSMC 3DFabric™ chip stacking and advanced packaging processes, InFO, CoWoS®, and SoIC, 3DFabric… 

46th EOS/ESD Symposium

46th Annual EOS/ESD Symposium & Exhibits

The EOS/ESD Symposium is dedicated to the understanding of issues related to electrostatic discharge and electrical transients/overstress, and the application of this knowledge to the solution of problems in consumer, industrial, and automotive applications, including… 

User2User Europe 2024

User2User Europe 2024

User2User is the perfect opportunity to learn, share and network with fellow technical experts who design leading-edge products using Siemens EDA tools. Dedicated to end-users of Siemens EDA solutions, this conference is free to attend… 

IP-SoC Silicon Valley 2024

IP-SoC Silicon Valley 2024

A worldwide connected Event !! D&R IP-SoC Silicon Valley 2024 Day is the unique worldwide Spring event fully dedicated to IP (Silicon Intellectual Property) and IP based Electronic Systems. IP-SoC providers, the seed of innovation… 

Siemens, April 11, 2024

Siemens EDA – TechDay Grenoble 2024

Siemens EDA Technology Day in Grenoble is your opportunity to learn, grow and connect with fellow technical experts who design leading-edge products using Siemens EDA tools. This event is dedicated to end users of Siemens… 

RISC-V Tokyo, 2024

RISC-V Day, Tokyo 2024 Winter

The RISC-V Day Tokyo conference is the largest RISC-V event in Japan. The RISC-V Day Tokyo 2024 Winter conference will be held on Tuesday, January 16, 2024 from 9:00-17:00 JST (UTC+9) at the Ito International… 

Siemens, December 7, 2023

Multi-Die System Verification with Siemens Avery UCIe VIP

Conventional monolithic SoCs are becoming a bottleneck for power, performance, and area (PPA), creating limitations for Data-intensive applications like high-performance computing (HPC), machine learning (ML) and artificial intelligence (AI), and for hyperscale data centers. These bottlenecks…