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IMAPS 2023

19th Annual Device Packaging Conference (DPC 2023)

The most comprehensive event this spring for microelectronics assembly & advanced packaging returns to Fountain Hills, Arizona.  The 19th Annual Device Packaging Conference (DPC 2023) will be held March 13-16, 2023, at the WeKoPa Conference Center. This esteemed… 

Tessent, February 9, 2023

Implementing DFT in 2.5/3D designs using Tessent Multi-die software

In the era of more-than-Moore’s law, chip makers are scaling by adopting complex architectures that connect dies vertically (3D IC) or side-by-side (2.5D). There has been progress throughout the semiconductor ecosystem in bringing 2.5D and… 

SEMICON Japan 2022

SEMICON Japan + Advanced Packaging and Chiplet Summit

SEMICON Japan is the premier event that brings together the semiconductor manufacturing supply chain for the latest insights, trends and innovations as the industry powers digital transformation. SEMI Japan 2022 will highlight Smart applications powered…