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Simplify & Streamline Development of ISO 26262 Compliant Automotive SoCs

June 22, 2022 @ 2:00 am - 3:00 pm EDT

SAE Media Group, June 22, 2022
Standards such as ISO 26262 define strict requirements, processes, and methods that all stakeholders – IP vendors, sub-system developers, and semiconductor SoC and system developers – must abide by when designing safety-critical automotive products. One such requirement is the Development Interface Agreement (DIA), which defines the interactions, interfaces, responsibilities, dependencies, and work products exchanged between customers and suppliers for all distributed safety-related activities.
This 60-minute Webinar explains the details of distributed development based on DIA and outlines the different activities for which DIAs must be signed during a distributed development process. In the second part of the presentation, an engineer from Infineon discusses their approach to meeting SoC-level functional safety objectives while closely collaborating with Synopsys.

Dietmar Koenig, Lead Principal Engineer, Infineon
Dietmar Koenig is a Lead Principal Engineer at Infineon with technical responsibility for the execution of safety-related work products in the Infineon Automotive Microcontroller division. He has 23 years of experience in microcontroller concept development at Siemens and Infineon and more than 18 years of experience on safety concepts for microcontrollers.

Vladimir Litovtchenko, Director, Functional Safety and Quality Engineering, Synopsys  
Vladimir Litovtchenko is a Director for the functional safety team at Synopsys. He has more than 19 years of experience in the semiconductor industry focusing on automotive functional safety products and development flows. He spent 12 years as Senior Systems and SoC Design Engineer at Freescale/NXP and nearly three years at Infineon as a Senior MCU Concept and Functional Safety Expert. As a Senior Staff Concept Engineer at Infineon, Vladimir worked on functional safety architectures and concepts for automotive MCU SoCs. He holds more than 23 EU and US patents and has published several papers and presentations.

Moderator: Amanda Hosey, Editor, SAE Media Group


June 22, 2022
2:00 am - 3:00 pm EDT
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