IP
-
Arm DevSummit
Palace of Fine Arts 3601 Lyon Street, San Francisco, CA, United StatesAfter two years of virtual networking, we’re thrilled to announce the return of Arm DevSummit in-person in October. As you’re a past attendee, we’re delighted to welcome you to this milestone event. Arm DevSummit is for people developing and deploying on Arm-based hardware. We want to give you, the future builders, the insight and edge… Arm DevSummit
-
TSMC 2022 OIP – California
Santa Clara Convention Center 5001 Great America Parkway, Santa Clara, CA, United StatesJoin the TSMC 2022 Open Innovation Platform Ecosystem Forum and learn from OIP partners how to leverage their technology for your design challenges! Register Now Learn About: Emerging advanced node design challenges and corresponding design flows and methodologies for N3/N3E, N4/N4P, N5/N5A, N6/N7, N12e, N22, and 28eF technologies Latest 3DIC chip stacking and advanced packaging… TSMC 2022 OIP – California
-
Silvaco – SURGE, North America
Silvaco is pleased to invite you to join its annual Silvaco UseRs Global Event (SURGE), taking place virtually on October 27, 2022. SURGE brings the TCAD, EDA, and IP communities together to discuss new technologies, share users’ experiences, and discover innovative techniques for advanced semiconductor design. Everyone that registers will be entered to win one… Silvaco – SURGE, North America
-
Evaluating UCIe based multi-die architectures to meet timing and power constraints
Multi-die architectures have evolved from proprietary to industry standard UCIe. UCIe can accommodate the bulk of designs today from 8 Gbps per pin to 32 Gbps per pin for high-bandwidth applications from networking to Hyperscale data centers. To help your UCIe adoption journey, we present VisualSim Architect and the associated UCIe/PCIe6.0 IPs to explore and… Evaluating UCIe based multi-die architectures to meet timing and power constraints
-
Linley Fall Processor Conference 2022
Hyatt Regency Santa Clara 5101 Great America Parkway, Santa Clara, CA, United StatesTechInsights is pleased to announce that the Linley Fall Processor Conference powered by TechInsights - a Hybrid Event, will be held in Santa Clara, California on November 1-2, 2022. If you cannot attend in person, tune in to our virtual livestream or watch the presentations OnDemand at your convenience. Presentations will address processors and IP… Linley Fall Processor Conference 2022
-
How CXL Technology will Revolutionize the Data Center
Data Centers face many challenges in an environment of exponentially rising data volume growth. With workload demands increasing rapidly, the need for more bandwidth and capacity continues to rise. Join us for a live webinar next week on November 2nd and hear IDC guest speaker, Jeff Janukowicz, and Rambus' Mark Orthodoxou discuss how CXL technology… How CXL Technology will Revolutionize the Data Center
-
TSMC 2022 EU OIP Ecosystem Forum
Hilton Amsterdam Airport Schiphol Schiphol Boulevard 701 Amsterdam, Amsterdam, NetherlandsLearn About: Emerging advanced node design challenges and corresponding design flows and methodologies for N3/N3E, N4/N4P, N5/N5A, N6/N7, N12e, N22, and 28eF technologies Latest 3DIC chip stacking and advanced packaging processes, and innovative 3DIC design enablement technologies and solutions targeting HPC and mobile applications Updated design solutions for specialty technologies enabling ultra-low voltage, analog migration,… TSMC 2022 EU OIP Ecosystem Forum
-
Super Computing 2022
Kay Bailey Hutchison Convention Center 650 S Griffin Street, Dallas, TX, United StatesCome see your friends and colleagues, explore incredible learning experiences in HPC, and walk the exhibit floor! There are several registration options available. Choose the one that’s right for you. We look forward to seeing you in Dallas or via the Digital Experience.
-
Semicon Europa
Messe Munchen Messegelände, Munich, GermanySEMICON Europa 2022 is co-located with electronica in Munich, Germany creating the strongest single event for electronics manufacturing in Europe, and broadening the range of attendees across the electronics chain. - Top-notch Keynotes - Market Trends - Exhibition - Networking - Advanced Packaging Forum / Fab Management Forum - ITF Beyond 5G -powered by imec… Semicon Europa
-
The Era of Chiplets and Heterogeneous Integration: Challenges and Emerging Solutions to Support 2.5D and 3D Advanced Packaging
As the semiconductor industry adopts chiplets and heterogeneous integration for its packaging as a key enabler to the continuation of scaling beyond Moore’s law, it has created new challenges. Join us on Wednesday, November 16 at 9:00 a.m. PST for an informative webinar on The Era of Chiplets and Heterogeneous Integration: Challenges and Emerging Solutions… The Era of Chiplets and Heterogeneous Integration: Challenges and Emerging Solutions to Support 2.5D and 3D Advanced Packaging
-
ASIP University Day 2022
Application-specific instruction set processors (ASIPs) have established themselves as an important implementation option for modern SoCs, i.e. when standard processor IP cannot meet challenging application-specific requirements, and fixed hardware is not flexible enough. Synopsys’ ASIP Designer is the market leading tool for ASIP design, verification and programming, and is used by leading companies around the… ASIP University Day 2022
-
CadenceLIVE Europe 2022
Hilton Munich Park Am Tucherpark 7, Munich, GermanyCadenceLIVE Europe 2022 will be held on November 21-22 at the Hilton Munich Park hotel. It will feature peer presentations that offer solutions for today’s design challenges that will impact tomorrow’s products. CadenceLIVE brings together users, developers, and industry experts to connect, share ideas, and inspire design creativity. Attendees will have the opportunity to attend captivating… CadenceLIVE Europe 2022