Webinar
Calendar of Events
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DFT for chiplets & 3D ICs using Tessent Multi-die
DFT for chiplets & 3D ICs using Tessent Multi-die
3D IC (2.5D/3D) designs are on the rise. Design for Test (DFT) for chiplets must be general purpose so they can be tested stand alone and easy to test after assembly into 2.5D or 3D devices. In this webinar you will learn how to use Tessent Multi-die and still adhere to standards like IEEE 1149.1,… Read More »DFT for chiplets & 3D ICs using Tessent Multi-die
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Smart methods for DFT chip architecture & validation
Smart methods for DFT chip architecture & validation
Combining market-leading design-for-test (DFT) technologies with best-in-class netlist synthesis allows you to achieve DFT success more quickly. Many customers, including those for emulation and IC test, have challenges with scaling architectures. This webinar describes how Siemens emulation and silicon test solutions can work together to provide a smart DFT plug-and-play architecture for Veloce ICs. The… Read More »Smart methods for DFT chip architecture & validation
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AI-Driven 3D System Analysis & Optimization for EM Antenna/RF Problems
AI-Driven 3D System Analysis & Optimization for EM Antenna/RF Problems
Antenna/RF design problems often involve the optimization of many variables, requiring numerous evaluations (EM simulations) using traditional optimization methods. Design engineers need an intelligent, accurate, and easy-to-use simulation platform and analysis solution that reduces repetitive design cycles while increasing user productivity and efficiency. Leveraging an advanced AI-enabled methodology, the Cadence Optimality Intelligent System Explorer delivers… Read More »AI-Driven 3D System Analysis & Optimization for EM Antenna/RF Problems
Cracking the Power Code: Innovative Approach to SoC Power Optimization
Cracking the Power Code: Innovative Approach to SoC Power Optimization
Power is the biggest factor impacting semiconductors from custom silicon to CPU/GPU products. System-level Power modeling and simulation is needed to measure power accurately and efficiently. The scope of power studies has expanded to include the software, thermal and generation to feed into the UVM/UPF methodology. At this Webinar we will highlight a new system-level… Read More »Cracking the Power Code: Innovative Approach to SoC Power Optimization
Innovative Approach to SoC Power Optimization
Innovative Approach to SoC Power Optimization
Power is the biggest factor impacting semiconductors from custom silicon to CPU/GPU products. System-level Power modeling and simulation is needed to measure power accurately and efficiently. The scope of power studies has expanded to include the software, thermal and generation to feed into the UVM/UPF methodology. At this Webinar we will highlight a new system-level… Read More »Innovative Approach to SoC Power Optimization
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AI-Driven EM-IR Design Closure
AI-Driven EM-IR Design Closure
IR drop closure is becoming a major challenge for designers on advanced nodes. The number of violations at signoff has increased significantly, leading to longer turnaround time (TAT) or violations being waived. To solve this challenge, IR drop needs to be addressed early in the implementation phase with an automated IR prevention and fixing methodology.… Read More »AI-Driven EM-IR Design Closure
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Accelerating AI Applications Using Custom RISC-V based SIMD/VLIW DSPs
Accelerating AI Applications Using Custom RISC-V based SIMD/VLIW DSPs
The revolution in AI triggers an increased awareness for application-specific instruction-set processors (ASIPs). These processors implement a specialized instruction-set architecture (ISA) tailored to the AI application domain, often starting from a baseline such as the RISC-V ISA. ASIPs can replace traditional fixed-function hardware accelerators, thereby introducing software-programmability in the AI acceleration domain, and thus more… Read More »Accelerating AI Applications Using Custom RISC-V based SIMD/VLIW DSPs