Webinar
DVClub Europe – Formal Verification
13 days to go the next DVClub Europe meeting takes place on Tuesday 23rd April with a theme of "Formal Verification". Formal Verification can help you find bugs earlier in the design cycle and… Read More »DVClub Europe – Formal Verification
Deploying Solido Design Environment AI Workflows on AWS
Utilizing AWS cloud resources to accelerate variation-aware verification AI-powered Solido Design Environment provides SPICE-accurate variation-aware verification for 3, 4, 5, 6 and higher sigma targets, orders of magnitude faster than… Read More »Deploying Solido Design Environment AI Workflows on AWS
The Era of Software-Defined Everything: Chiplets and Bespoke Silicon
From fintech to automotive, defense to healthcare, everyone wants bespoke computing platforms to build "software-defined solutions" that are differentiated in their respective markets. Sign up and save your spot for… Read More »The Era of Software-Defined Everything: Chiplets and Bespoke Silicon
Improving Semiconductor Wafer Fabrication Process Efficiencies Using Ansys Solutions
Ansys Semiconductor Manufacturing Webinar Series: Part 1 of 3. Join us on Thursday, April 25th for an in-depth view of multi-physics simulation in the semiconductor fabrication process. Overview Accurate design… Read More »Improving Semiconductor Wafer Fabrication Process Efficiencies Using Ansys Solutions
DFT for chiplets & 3D ICs using Tessent Multi-die
3D IC (2.5D/3D) designs are on the rise. Design for Test (DFT) for chiplets must be general purpose so they can be tested stand alone and easy to test after… Read More »DFT for chiplets & 3D ICs using Tessent Multi-die
Smart methods for DFT chip architecture & validation
Combining market-leading design-for-test (DFT) technologies with best-in-class netlist synthesis allows you to achieve DFT success more quickly. Many customers, including those for emulation and IC test, have challenges with scaling… Read More »Smart methods for DFT chip architecture & validation
AI-Driven 3D System Analysis & Optimization for EM Antenna/RF Problems
Antenna/RF design problems often involve the optimization of many variables, requiring numerous evaluations (EM simulations) using traditional optimization methods. Design engineers need an intelligent, accurate, and easy-to-use simulation platform and… Read More »AI-Driven 3D System Analysis & Optimization for EM Antenna/RF Problems
Cracking the Power Code: Innovative Approach to SoC Power Optimization
Power is the biggest factor impacting semiconductors from custom silicon to CPU/GPU products. System-level Power modeling and simulation is needed to measure power accurately and efficiently. The scope of power… Read More »Cracking the Power Code: Innovative Approach to SoC Power Optimization
Innovative Approach to SoC Power Optimization
Power is the biggest factor impacting semiconductors from custom silicon to CPU/GPU products. System-level Power modeling and simulation is needed to measure power accurately and efficiently. The scope of power… Read More »Innovative Approach to SoC Power Optimization
Innovative Technologies, Tools, and Methodologies for Space Applications
In the world of space applications, reliability is paramount. As the space sector continues to experience rapid growth and evolution, new challenges are emerging to meet the demands of various… Read More »Innovative Technologies, Tools, and Methodologies for Space Applications
AI-Driven EM-IR Design Closure
IR drop closure is becoming a major challenge for designers on advanced nodes. The number of violations at signoff has increased significantly, leading to longer turnaround time (TAT) or violations… Read More »AI-Driven EM-IR Design Closure
The Next Generation of 3DIC Interposer/InFO Design
In recent years, the semiconductor industry has experienced a breakthrough in the onset of 2.5D and 3D chiplet-based products. These products promise to extend the limits of Moore’s Law while… Read More »The Next Generation of 3DIC Interposer/InFO Design