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International Microwave Symposium
Denver Convention Center 700 14th Street, Denver, CO, United StatesIMS is the flagship event in a week dedicated to all things microwaves and RF. The week also includes the IEEE MTT-S Radio Frequency Integrated Circuits Symposium (RFIC) and the Automatic Radio Frequency Techniques Group (ARFTG).
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ASYNC 2022 Summer School: Physical Design
The steering committee of the IEEE ASYNC symposium is organizing a summer school on asynchronous design. The goal of the school is to teach asynchronous chip design to students and practitioners interested in digital hardware design. Participants will learn how to design asynchronous circuits at the behavioral level, gate level, and physical design level using… ASYNC 2022 Summer School: Physical Design
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TSMC 2022 Technology Symposium – Europe
Hilton Amsterdam Airport Schiphol Schiphol Boulevard 701 Amsterdam, Amsterdam, NetherlandsEurope Technology Symposium (In-Person Event) Date June 20, 2022 (Monday) Time 8:30a.m. - 4:50p.m. Venue Hilton Amsterdam Airport Schiphol Schiphol Boulevard 701Amsterdam,1118BN Netherlands Israel Technology Workshop (In-Person Event) Date June 28, 2022 (Tuesday) Time 9:30a.m. - 4:30p.m. Venue Daniel Herzliya Hotel Ramat Yam St 60, Herzliya, Israel Europe Technology Symposium (Online VOD Event) Date June… TSMC 2022 Technology Symposium – Europe
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Leti Innovation Days
Minalogic 3 PARV Louis Neel, Grenoble, FranceThe chip shortage has brought with it an extraordinary boost to Moore's Law. Discover policy maker and tech leader strategic decisions on downscaling, "More than Moore electronics" and other future technologies for components. Identify key emerging technologies to grow your business. Plenary Session A plenary session will gather high-level keynote speakers to discuss novel tech strategies… Leti Innovation Days
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Writing UVM/SystemVerilog Testbenches for Analog/Mixed-Signal Verification
Learn how to write UVM testbenches for analog/mixed-signal circuits. UVM (Universal Verification Methodology) is a framework of standardized SystemVerilog classes to build reusable and scalable testbenches for digital designs, and it can be extended to verifying analog circuits simply by using a fixture module that generates analog stimuli and measures analog responses with Scientific Analog's… Writing UVM/SystemVerilog Testbenches for Analog/Mixed-Signal Verification
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Embedded World 2022
Exhibition Centre Nuremberg Nuremberg, GermanyWhether it's the safety of electronic systems, distributed intelligence, the Internet of Things or e-mobility and energy efficiency – the embedded world trade fair lets you experience the whole world of embedded systems. Discover the innovations of the embedded sector, meet experts and win new customers. embedded world offers the entire spectrum – from components,… Embedded World 2022
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NAFEMS Americas Conference 2022
Indianapolis Convention Center 1861 Monument Circle, Indianapolis, IN, United StatesNAFEMS Americas will be hosting its biennial regional conference, formerly known as CAASE, on June 21-23, 2022, face-to-face, at the Indiana Convention Center in Indianapolis, Indiana! The NAFEMS Americas Regional Conference 2022 (NRC22 Americas) will bring together the leading visionaries, developers, and practitioners of CAE-related technologies in an open forum, unlike any other, to share experiences, discuss relevant trends,… NAFEMS Americas Conference 2022
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Simplify & Streamline Development of ISO 26262 Compliant Automotive SoCs
Standards such as ISO 26262 define strict requirements, processes, and methods that all stakeholders – IP vendors, sub-system developers, and semiconductor SoC and system developers – must abide by when designing safety-critical automotive products. One such requirement is the Development Interface Agreement (DIA), which defines the interactions, interfaces, responsibilities, dependencies, and work products exchanged between… Simplify & Streamline Development of ISO 26262 Compliant Automotive SoCs
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Cost effective 5G for the IoT
5G RedCap is an exciting new 3GPP feature, soon to be introduced in Rel. 17 of the standard, targeting reduced capability use cases for industrial, wearables, and IoT in general. We will discuss the new standard, the market potential, and CEVA’s new PentaG2-Lite comprehensive baseband modem solution. Join CEVA to learn about: Introduction to the… Cost effective 5G for the IoT
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Extending Processors into Flexible Accelerators for 5G
The slowing down of Moore’s law and Dennard scaling has triggered an increased interest in application-specific instruction set processors (ASIPs). ASIPs implement a specialized instruction set architecture (ISA) tailored to the application and can replace traditional fixed-function hardware accelerators, thereby introducing software-programmability in the acceleration domain, and thus more flexibility and agility in both the… Extending Processors into Flexible Accelerators for 5G
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Constraints-Driven CDC and RDC Verification Including UPF Aware Analysis
Today’s million gates integrated circuits (ICs) involve various intellectual properties (IPs) interfacing with each other through multiple asynchronous clock and reset domains. Ensuring all clocks propagate concurrently across each clock tree components used as clock switching elements or each sequential or combinatorial component, clock output of which becomes asynchronous with respect to the clock input… Constraints-Driven CDC and RDC Verification Including UPF Aware Analysis
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Advances in OSVVM’s Verification Data Structures
OSVVM has grown tremendously over the last couple of years. This period saw simulator independent scripting, test reporting, model independent transactions, virtual transaction interfaces, and additional verification components, each added and incrementally improved. We have talked about these previously in this webinar series. This webinar focuses on advances in OSVVM data structures. OSVVM's Functional Coverage,… Advances in OSVVM’s Verification Data Structures
12 events found.