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The ROI of User Experience Design: Increase Sales and Minimize Costs
In today's competitive landscape for IoT, edge, and cloud solutions, User Experience (UX) design has become more crucial than ever in achieving customer and business goals. During this live webinar,… The ROI of User Experience Design: Increase Sales and Minimize Costs
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DVClub Europe – Performance Testing and Analysis
Discuss the performance verification challenges posed by complex SoC with distributed cache from cluster, to interconnect to die-to-die. Agenda (BST) 12:00 Welcome and Introduction – Mike Bartley, Tessolve 12:00 Nick… DVClub Europe – Performance Testing and Analysis
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IP SoC Silicon Valley 23
Computer History Museum 1401 N. Shoreline Blvd, Mountain View, CA, United StatesD&R IP-SoC Silicon Valley 2023 Day is the unique worldwide Spring event fully dedicated to IP (Silicon Intellectual Property) and IP based Electronic Systems. IP-SoC providers, the seed of innovation… IP SoC Silicon Valley 23
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TSMC – North America Technology Symposium
Santa Clara Convention Center 5001 Great America Parkway, Santa Clara, CA, United StatesJoin us and learn about: TSMC's smartphone, HPC, IoT, and automotive platform solutions TSMC's advanced technology progress on 5nm, 4nm, 3nm, 2nm processes and beyond TSMC's specialty technology breakthroughs on… TSMC – North America Technology Symposium
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Advancing Magnetic Memory Technology with Atomistic Modeling
In this event, experts from Martin-Luther-Universitat Halle Wittenberg, University of York, and Synopsys QuantumATK will present how to use ab initio DFT modeling and atomistic spin dynamics simulations of MTJs… Advancing Magnetic Memory Technology with Atomistic Modeling
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Maximize Performance and Efficiency of Multi-die Data Center Chip Designs with Arm CoreLink CMN-700 and Synopsys Platform Architect
This webinar will showcase the design, analysis, and optimization of a multi-die fabric architecture based on the next generation Arm® CoreLink™ CMN-700 interconnect, a high-performance cache coherent interconnect solution designed… Maximize Performance and Efficiency of Multi-die Data Center Chip Designs with Arm CoreLink CMN-700 and Synopsys Platform Architect
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How Deep Data Analytics Accelerates SoC Time-To-Market by 6 Months
This webinar will cover how using deep data analytics: Accelerates time-to-market by 20-25% (equivalent to six months in this example), ensuring the product is first to market and able to capitalize… How Deep Data Analytics Accelerates SoC Time-To-Market by 6 Months
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CadenceTECHTALK: System-Level Thermal Signoff from Chips Through to Racks
Today’s modern electronic designs require ever more functionality and performance to meet consumer demand. These challenges become more critical and complex when resistive losses in PCB and package structures are… CadenceTECHTALK: System-Level Thermal Signoff from Chips Through to Racks
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The Path to 1.6TbE with 224G Ethernet PHY IP
The need for faster and more efficient Ethernet solutions has never been greater, as the demands of high-performance computing and the rise of big data continue to grow. Join us… The Path to 1.6TbE with 224G Ethernet PHY IP
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The Power of VHDL’s VHPI
The programming interfaces of logic simulators are largely the domain of specialists writing proprietary tools and extensions and are only vaguely in the consciousness of many design and verification engineers,… The Power of VHDL’s VHPI
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IEEE International Symposium on Hardware Oriented Security and Trust (HOST)
The DoubleTree by Hilton 2050 Gateway Place, San Jose, CA, United StatesIEEE International Symposium on Hardware Oriented Security and Trust (HOST) is the premier symposium that facilitates the rapid growth of hardware-based security research and development. Since 2008, HOST has served as… IEEE International Symposium on Hardware Oriented Security and Trust (HOST)
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Design Robust IC Packages Faster Using In-Design SI/PI Analysis
IC package design teams and characterization teams have had a “throw-it-over-the-wall” relationship for decades, which often delays design releases by months. However, as signal integrity (SI) and power integrity (PI)… Design Robust IC Packages Faster Using In-Design SI/PI Analysis
12 events found.