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Driving Forward with UWB Radar: Enhancing Child Safety in Automotive
Fueled by the recent adoption by leading smartphone brands, the UWB wireless technology is enjoying an explosive growth in market interest and applications. In automotive, UWB is already the de-facto… Driving Forward with UWB Radar: Enhancing Child Safety in Automotive
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PCI-SIG Developers Conference 2023
Santa Clara Convention Center 5001 Great America Parkway, Santa Clara, CA, United StatesThe PCI-SIG Developers Conference 2023 is returning to Santa Clara on June 13-14, 2023! Members of the PCI-SIG community including systems architects, designers, engineers, and engineering managers agree that this is… PCI-SIG Developers Conference 2023
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GSA 2023 European Executive Forum
Sofitel Munich Bayerpost Bayerstrasse 12, Munich, GermanyDealing with Uncertainty The global economy is sending mixed messages, and with every new data release comes a new batch of upbeat or defeatist headlines. Uncertainty remains if inflation is… GSA 2023 European Executive Forum
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Verify Your SoC Design Efficiently from Planning to Coverage Closure using Synopsys Verification Family
Verifying an SoC is an extremely complex process that requires agile turnaround, constant control feedback, and flexibility to adapt to evolving project needs. Coverage is an efficient metric for the… Verify Your SoC Design Efficiently from Planning to Coverage Closure using Synopsys Verification Family
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Microelectronics Design Security: Better with Formal Methods
Whether you are developing Systems-on-Chip (SoCs) for mobile and wearables, automotive, aerospace, defense, data centers, or entertainment, securing your proprietary data and customers’ information is critical to your company’s long-term… Microelectronics Design Security: Better with Formal Methods
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SNUG Taiwan 2023
Sheraton Hsinchu Hotel No. 265號, E Section 1, Guangming 6th Rd, Zhubei City, TaiwanAs the electronics industry's largest user conference, SNUG Taiwan is dedicated to demonstrating the state-of-the-art innovations from the chip design community around the globe. This year, we are excited to… SNUG Taiwan 2023
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Designing for Six Sigma: Electronics Simulation Powered by Parametric Variation
The webinar focuses on the simulation-driven optimization of electronics, Integrated Circuits applications to achieve a six-sigma level of quality. Electronics are part of our daily life, with innovative and connected… Designing for Six Sigma: Electronics Simulation Powered by Parametric Variation
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RISC-V Days Tokyo 2023 Summer
Ito International Research Center The University of Tokyo, Tokyo, JapanRISC-V Day Tokyo 2023 Summer Conference is Japan’s largest RISC-V real event. RISC-V Day Tokyo 2023 Summer Conference will be held on June 20, 2023 (Tuesday) from 9:00 to 20:30… RISC-V Days Tokyo 2023 Summer
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Leveraging Silicon Lifecycle Management (SLM) for Automotive Applications
Automobiles are today’s supercomputers and with that statement comes great challenges. A vehicle is a highly demanding environment for electronics. Temperature and humidity extremes, noise and vibration, electrical interference, exposure… Leveraging Silicon Lifecycle Management (SLM) for Automotive Applications
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Applying AI/ML Technology for Rapid Design Optimization
The problem of optimization is a long-standing one in the field of design. For years, the most conventional approach was the brute-force method of running parametric sweeps on the design… Applying AI/ML Technology for Rapid Design Optimization
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Achieve Out-of-the-Box Equivalence Checking with Synopsys Formality ML-driven Distributed Processing
When designers synthesize chip designs with aggressive PPA targets, the expectation and goal is to be able to complete verification with minimal effort and a fast turn-around-time. Synopsys Design Compiler… Achieve Out-of-the-Box Equivalence Checking with Synopsys Formality ML-driven Distributed Processing
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Design and Analysis of Multi-Die & 3D-IC Systems
The architecture and heterogeneous integration capability of 3D-IC (three-dimensional integrated circuits) offer many benefits. The latest configuration methods, CoWoS (Chip On Wafer on Substrate) and WoW (Wafer on Wafer) from… Design and Analysis of Multi-Die & 3D-IC Systems
12 events found.