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SemIsrael Tech Webinar

Stay Tuned... Advanced RISC-V processor verification and methodologies This talk will outline the latest advances in RISC-V functional verification to address the demands of high-reliability and automotive applications, including the innovations in processor designs with features such as: out-of-order pipelines, hardware multi-threading, multi-hart, custom extensions and advanced privileged modes, plus vector accelerators. Key updates will… Read More »SemIsrael Tech Webinar

Protocol and Memory Interface Verification in the Shrinking World of 3DIC

Emerging 2.5D and 3DIC packaging technologies enable more design complexity, and bring some new verification challenges. We look at how to scale your verification capability to match and how to plan ahead for verification of die-to-die interconnect protocols such as UCIe and memory verification with HBM. Packaging technologies for 2.5D and 3DIC are becoming more… Read More »Protocol and Memory Interface Verification in the Shrinking World of 3DIC

Unleashing Innovation with UCIe​​​​​​​​​​​​​​

Exploring the Next Frontier in Chip Integration Webinar Agenda : Introduction to all UCIe layers Decrypting FLITs, PHY Trainings, Bring up flows FDI-RDI , main band and side band FLIT transfers etc. Implementation of Stacks-Arbiter, Retry mechanism & Retimer implementations Showcasing UCie FLIT transfer flow between multidies Enhancements done in UCIe 1.1 Who Should Attend:… Read More »Unleashing Innovation with UCIe​​​​​​​​​​​​​​

Multi-Die System Verification with Siemens Avery UCIe VIP

Conventional monolithic SoCs are becoming a bottleneck for power, performance, and area (PPA), creating limitations for Data-intensive applications like high-performance computing (HPC), machine learning (ML) and artificial intelligence (AI), and for hyperscale data centers. These bottlenecks are challenging Moore’s law, hindering the industry’s ability to continue scaling designs. Chiplets are rapidly becoming the means to overcome… Read More »Multi-Die System Verification with Siemens Avery UCIe VIP

Comprehensive CXL 3.0 Verification Solution for High-Bandwidth and Low-Latency Connectivity

Join us for a deep dive into the most comprehensive CXL Verification IP solution available in the market that targets 1.1, 2.0 and 3.0, Siemens Avery CXL Verification IP. Compute Express Link (CXL) is an open industry-standard interconnect offering coherency and memory semantics using high- bandwidth, low-latency connectivity between host processor and devices such as… Read More »Comprehensive CXL 3.0 Verification Solution for High-Bandwidth and Low-Latency Connectivity