Skip to content

Cadence

Cadence, October 31, 2023

Enhance Verification Quality with the Xcelium Mixed-Signal App

The comprehensive verification of analog mixed-signal (AMS) designs has challenges in schedules and implementations due to the vast divergence in design flows of the analog… Read More »Enhance Verification Quality with the Xcelium Mixed-Signal App

Cadence, November 2 2023

IR 2.0 – Building a New Paradigm for Power Integrity Design and Analysis

Power integrity (PI) is a major challenge for chip designers in the era of ubiquitous data, hyperconnectivity, and AI. Design size is exploding, and innovations… Read More »IR 2.0 – Building a New Paradigm for Power Integrity Design and Analysis

Cadence, October 18, 2023

System-Level Thermal Signoff from Chips Through to Racks

Today’s modern electronic designs require ever more functionality and performance to meet consumer demand. These challenges become more critical and complex when resistive losses in… Read More »System-Level Thermal Signoff from Chips Through to Racks

IMAPS 2023

56th International Microelectronics Assembly and Packaging Society (IMAPS)

This packed conference brings together industry engineers, researchers and top experts involved in advanced packaging and microelectronics assembly.  IMAPS Symposium offers a robust technical program with… Read More »56th International Microelectronics Assembly and Packaging Society (IMAPS)