FMS: the Future of Memory and Storage is an all-inclusive international memory and storage showcase. It is the event for the memory and storage industry. It is the one-stop place to catch up on the latest… Future of Memory and Storage – 2024
Multi-die SoC containing multiple RISC-V clusters, GPU, NPU, accelerators and DNN have considerable benefits for applications in automotive, space and industrial. Architecture exploration of the chiplet-based SoC requires multiple interconnect protocol models, and multiple coherent… Optimizing Chiplet architectures of RISC-V clusters, GPU and DNN using System-Level IP
Multi-die SoC containing multiple RISC-V clusters, GPU, NPU, accelerators and DNN have considerable benefits for applications in automotive, space and industrial. Architecture exploration of the chiplet-based SoC requires multiple interconnect protocol models, and multiple coherent… Optimizing Chiplet architectures of RISC-V clusters, GPU and DNN using System-Level IP
Semiconductor companies are making transistors smaller and cramming more into chips to meet the demands of today’s high-tech industries and applications. In fact, in a recent article from the Financial Times, technology industry consultants McKinsey forecast that… Exploring the Advancement of Chiplet Technology and the Ecosystem
Conventional monolithic SoCs are becoming a bottleneck for power, performance, and area (PPA), creating limitations for Data-intensive applications like high-performance computing (HPC), machine learning (ML) and artificial intelligence (AI), and for hyperscale data centers. These bottlenecks… Multi-Die System Verification with Siemens Avery UCIe VIP
Artificial intelligence (AI) and virtual reality (VR) require fast, efficient, low-power technologies. Transistors are becoming harder and harder to shrink, so chiplets are a promising alternative. Chiplets are small, modular dies that use UCIe, an open industry standard, to communicate… Why Chiplets with UCIe are the Next Big Thing
Exploring the Next Frontier in Chip Integration Webinar Agenda : Introduction to all UCIe layers Decrypting FLITs, PHY Trainings, Bring up flows FDI-RDI , main band and side band FLIT transfers etc. Implementation of Stacks-Arbiter,… Unleashing Innovation with UCIe
Presenter: Dr. Debendra Das Sharma, UCIe Consortium Chairman and Intel Senior Fellow, Chief Architect of I/O Technology and Standards at Intel The UCIe™ (Universal Chiplet Interconnect Express™) 1.1 Specification was released in August 2023, delivering valuable… The UCIe™ 1.1 Specification: Future Applications of Chiplets
Innovative die disaggregation technologies, enable a future where a catalog of chiplets will be available to mix and match based on the end application. The industry’s fastest emerging interconnect standard called Universal Chiplet Interconnect Express… UCIe-Based Chiplet Verification – from IP to SoC
Innovative die disaggregation technologies, enable a future where a catalog of chiplets will be available to mix and match based on the end application. The industry’s fastest emerging interconnect standard called Universal Chiplet Interconnect Express… UCIe-Based Chiplet Verification – from IP to SoC