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Siemens, December 7, 2023

Multi-Die System Verification with Siemens Avery UCIe VIP

Conventional monolithic SoCs are becoming a bottleneck for power, performance, and area (PPA), creating limitations for Data-intensive applications like high-performance computing (HPC), machine learning (ML)… Read More »Multi-Die System Verification with Siemens Avery UCIe VIP

Truechip, September 26, 2023

Unleashing Innovation with UCIe​​​​​​​​​​​​​​

Exploring the Next Frontier in Chip Integration Webinar Agenda : Introduction to all UCIe layers Decrypting FLITs, PHY Trainings, Bring up flows FDI-RDI , main… Read More »Unleashing Innovation with UCIe​​​​​​​​​​​​​​

Siemens EDA

Protocol and Memory Interface Verification in the Shrinking World of 3DIC

Emerging 2.5D and 3DIC packaging technologies enable more design complexity, and bring some new verification challenges. We look at how to scale your verification capability… Read More »Protocol and Memory Interface Verification in the Shrinking World of 3DIC