CICC 2023
Sponsored by IEEE and SSCS, the IEEE Custom Integrated Circuits Conference – CICC – is a premier conference devoted to IC development. The conference program is a blend of oral presentations,… Read More »CICC 2023
D&R IP-SoC Silicon Valley 2023
Hyatt Regency Santa Clara 5101 Great America Parkway, Santa Clara, CA, United StatesWhere : Hyatt Regency Santa Clara 5101 Great America Parkway, Santa Clara, CA D&R IP-SoC Silicon Valley 2023 Day is the unique worldwide Spring event fully dedicated to IP (Silicon… Read More »D&R IP-SoC Silicon Valley 2023
41st IEEE VLSI Test Symposium 2023
Hyatt Regency Mission Bay Spa & Marina 1441 Quivira Road, San Diego, CA, United StatesThe IEEE VLSI Test Symposium (VTS) explores emerging trends and novel concepts in test, validation, yield, reliability, and security of microelectronic circuits and systems. The symposium will take place on… Read More »41st IEEE VLSI Test Symposium 2023
RSAConference 2023
Moscone Center 747 Howard Street, San Francisco, CA, United StatesWhere the World Talks Security™ Don’t miss the opportunity to take your knowledge and skills to the next level at RSAC 2023. Not sure if the complete Conference experience will… Read More »RSAConference 2023
The ROI of User Experience Design: Increase Sales and Minimize Costs
In today's competitive landscape for IoT, edge, and cloud solutions, User Experience (UX) design has become more crucial than ever in achieving customer and business goals. During this live webinar,… Read More »The ROI of User Experience Design: Increase Sales and Minimize Costs
DVClub Europe – Performance Testing and Analysis
Discuss the performance verification challenges posed by complex SoC with distributed cache from cluster, to interconnect to die-to-die. Agenda (BST) 12:00 Welcome and Introduction – Mike Bartley, Tessolve 12:00 Nick… Read More »DVClub Europe – Performance Testing and Analysis
IP SoC Silicon Valley 23
Computer History Museum 1401 N. Shoreline Blvd, Mountain View, CA, United StatesD&R IP-SoC Silicon Valley 2023 Day is the unique worldwide Spring event fully dedicated to IP (Silicon Intellectual Property) and IP based Electronic Systems. IP-SoC providers, the seed of innovation… Read More »IP SoC Silicon Valley 23
TSMC – North America Technology Symposium
Santa Clara Convention Center 5001 Great America Parkway, Santa Clara, CA, United StatesJoin us and learn about: TSMC's smartphone, HPC, IoT, and automotive platform solutions TSMC's advanced technology progress on 5nm, 4nm, 3nm, 2nm processes and beyond TSMC's specialty technology breakthroughs on… Read More »TSMC – North America Technology Symposium
Advancing Magnetic Memory Technology with Atomistic Modeling
In this event, experts from Martin-Luther-Universitat Halle Wittenberg, University of York, and Synopsys QuantumATK will present how to use ab initio DFT modeling and atomistic spin dynamics simulations of MTJs… Read More »Advancing Magnetic Memory Technology with Atomistic Modeling
Maximize Performance and Efficiency of Multi-die Data Center Chip Designs with Arm CoreLink CMN-700 and Synopsys Platform Architect
This webinar will showcase the design, analysis, and optimization of a multi-die fabric architecture based on the next generation Arm® CoreLink™ CMN-700 interconnect, a high-performance cache coherent interconnect solution designed… Read More »Maximize Performance and Efficiency of Multi-die Data Center Chip Designs with Arm CoreLink CMN-700 and Synopsys Platform Architect
How Deep Data Analytics Accelerates SoC Time-To-Market by 6 Months
This webinar will cover how using deep data analytics: Accelerates time-to-market by 20-25% (equivalent to six months in this example), ensuring the product is first to market and able to capitalize… Read More »How Deep Data Analytics Accelerates SoC Time-To-Market by 6 Months
CadenceTECHTALK: System-Level Thermal Signoff from Chips Through to Racks
Today’s modern electronic designs require ever more functionality and performance to meet consumer demand. These challenges become more critical and complex when resistive losses in PCB and package structures are… Read More »CadenceTECHTALK: System-Level Thermal Signoff from Chips Through to Racks