The layout implementation of analog circuits in advanced FinFET technologies is becoming increasingly complex and challenging, with many new design rules to consider and multi-patterning, density rules, matching, and EM-IR concerns. These challenges can translate… Tackling Advanced Analog FinFET Back-End Design Challenges
Analog engineers adopting advanced FinFET technologies face many challenges that were not present when using planar transistors. Challenges in layout implementation have a direct impact on design specifications, and the luxury of over-margining is long… Tackling Advanced Analog FinFET Front-End Design Challenges with Better Methodologies
Join Cadence Training and Principal Application Engineer Vladimir Papic for this free technical Training Webinar. Cadence® Sigrity™ Aurora is a signal and power integrity (SI/PI) analysis solution, tightly integrated into the Allegro® PCB design environment.… Signal and Power Integrity Analysis with Sigrity Aurora
TechInsights is pleased to continue the semi-annual Linley Processor Conferences, established more than a decade ago. This year, the Linley Spring Processor Conference will return to Santa Clara on April 20-21, 2022 with a new… Linley Spring Processor Conference 2022
Overview 3D finite element method (FEM) and 3D planar method of moments (MoM) have become a standard design practice for ensuring the accuracy of the overall network simulation. However, without proper setup and use of… In-Design EM Analysis for Microwave/RF Design and Verification Workflows
The Design and Verification Conference & Exhibition Europe (DVCon Europe) is the premier European technical conference on system, software, design, verification, validation or integration. It is a place where the latest methodologies and technologies for… DVCon Europe 2022
Is formal verification ready for general use or do you need a PhD to use it? Larger companies continue to recruit formal PhDs into their verification teams while other less-qualified engineers seem reluctant to go… Formal Verification for non-specialists
The 18th Annual Device Packaging Conference (DPC 2022) will be held at the WeKoPa Resort and Conference Center, from March 7-10, 2022. It is an international event organized by the International Microelectronics Assembly and Packaging Society (IMAPS). The conference is a… IMAPS Device Packaging
Are you driving design change or feel you’ve overcome challenges that could impact the electronic revolution? CadenceLIVE™ offers you an opportunity to tell your story. Showcase your expertise and offer tips to address the complexities… CadenceLIVE 2022 – Silicon Valley
The Cadence® Clarity™ 3D Solver, utilized by scores of customers across the globe, continues to accelerate design flows for leading companies in industries such as medical, hyperscale computing, 5G, automotive, and industrial internet of things (IIoT). The… What’s New in Clarity 2022.1