Webinar
Events
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Enabling Electromagnetic Simulations with Encrypted Components
High-fidelity simulations in the ever-widening realm of complete systems analysis requires incorporating vendor-supplied models for accuracy. However, vendors are reluctant to share their proprietary intellectual property. Cadence enables the ecosystem and supports model creators by allowing them to encrypt their geometries and protect their IP while sharing them with their customers for simulation. This webinar will…
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Webinar Series | RISC-V Ready for Prime Time?
Join us for session II of our webinar series where we delve into the intricacies of RISC-V core integration and explore strategies to overcome the unique verification challenges that design and verification engineers encounter along the way. Whether you're an engineer looking to enhance your understanding of RISC-V or a technology enthusiast keen on staying…
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System Simulation of Versal ACAP Designs
AVersal ACAP, developed by Xilinx/AMD, is a groundbreaking adaptable platform composed of AI Engine (AIE), Processing System (PS), Programmable Logic (PL), Network on Chip (NoC) and a wide range of hardened domain-specific IPs. Versal ACAP enables the efficient execution of complex algorithms and accelerates workloads, including machine learning, embedded computing, and high-performance computing. In this…
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Latest Innovations and Updates in ASICs
In this webinar Jeff DiCorpo & Matt Venn will delve into the latest ASIC developments, including the game-changing OpenFrame – a new Caravel version expanding your design possibilities by 50%. Topics Include: - OpenFrame - a new version of Caravel that gives 50% more area - GPIO configuration questions - The new cocotb testing framework…
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RTL Power Optimization: Applying Best Practices to Overcome Low-Power Design Challenges
Designers face enormous challenges for low-power designs. Whether it is IoT at the edge, AI in the datacenter, robotics or ADAS, the demand for increased functionality in SoCs is rapidly outpacing the power budget. Power must be considered at every stage of chip design including performance, reliability and packaging. Waiting to address power until late…
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Making the Right Connections – Taking the Guess Work out of DFT Connectivity Validation
System-on-Chip (SoC) designs continue to grow in both size and complexity in order to meet the ever-growing performance and power demands associated with modern technology. To keep up with this fast-paced evolution, the corresponding design-for-test (DFT) logic required for manufacturing tests has also become more complex. Increasing transistor density, combined with a growing mix of…
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Auto-generation of Verification Infrastructure for IP to SoC
Agenda (BST): Time Session Description Slides Videos 12.00 GMT Welcome and Introduction Mike Bartley,Tessolve 12.00 GMT Agnisys 12.30 GMT Imperas 12.45 GMT Breker 13.00 GMT Close About DVClub The principal goal of each DVCLUB meeting is to have fun while helping build the European verification community through regular educational and networking events. Attendance at DVClub Europe…
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CMOS Circuit Techniques for Wireline Transmitters Part II
Synopsys Webinar – Part II In this 3-part Synopsys webinar series, we will present how hyperscale data centers are going through a paradigm shift with the advent of technologies like Artificial Intelligence (AI) and edge compute requiring hyperscale data centers to support exponential growth of data volume. This volume of network traffic demands an increase…
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Large Eddy CFD Simulation for Automotive Aerodynamics
Wall-modeled large eddy simulations (WMLES) of complex vehicle geometries offer highly accurate results but can be challenging in terms of speed and cost. In this webinar, learn how to maximize the throughput of these simulations with Fidelity CharLES and how the solver’s GPU acceleration lowers the cost of using WMLES in engineering design. We will…
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Latest Innovations and Updates in ASICs with Efabless
In this webinar Jeff DiCorpo & Matt Venn will delve into the latest ASIC developments, including the game-changing OpenFrame – a new Caravel version expanding your design possibilities by 50%. Topics Include: OpenFrame - a new version of Caravel that gives 50% more area GPIO configuration questions The new cocotb testing framework IPM - The…
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Rigid Flex PCB In-Design Electromagnetic Analysis Workflow
Today's electronic products increasingly use Rigid-Flex PCBs to compress form factors, reduce weight, and increase cost-effectiveness. For many commercially available 3D numerical solver technologies (FEM and FDTD), the electromagnetic (EM) analysis of rigid-flex PCBs has always been challenging due to the complexity of the 3D designs. Much of this complexity comes from bending the board into…
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Multi-Die System Verification with Siemens Avery UCIe VIP
Conventional monolithic SoCs are becoming a bottleneck for power, performance, and area (PPA), creating limitations for Data-intensive applications like high-performance computing (HPC), machine learning (ML) and artificial intelligence (AI), and for hyperscale data centers. These bottlenecks are challenging Moore’s law, hindering the industry’s ability to continue scaling designs. Chiplets are rapidly becoming the means to overcome…