Cadence
DVCON India
This conference will give you ample opportunities to share and highlight your technical contibutions in the areas of Verificaiton and Validations, Methodology & Automation, Functional Safety & Security, Low Power and Mixed Signal Design, Static and Formal methods and Digital Twins and SystemC Modeling. Kindly use this opportunity and register yourself for the conference.… DVCON India
Design and Analysis Solutions for Integrated RF Systems
Opening Keynote 10:00am EST | Cadence Solutions for RF Design Excellence, presented by David Vye, Dr. Melika Roshandell, Graeme Richie, Dr. Yashwanth Reddy Padooru, Gus Dallman, Shane Coffman, Cadence Technical Talks 11:00am EST | Design of Integrated Phased-Array Antenna Systems for 5G CPE, presented by David Vye, Andy Hughes, Cadence 1:00pm EST | Simulation and… Design and Analysis Solutions for Integrated RF Systems
Club Formal India
Summary: Cadence is pleased to once again bring you Club Formal, a platform for formal verification experts to come together and discuss the latest in formal technologies, including challenges, benefits, and best practices. Hear from your peers on how they are using formal verification techniques in their flows and interact with members of the Cadence® R&D… Club Formal India
IEEE Rising Stars Conference
Tropicana Las Vegas 3801 S Las Vegas Blvd, Las Vegas, NV, United StatesWhere Students and Young Professionals Come to Connect and be Inspired As a premier event, IEEE Rising Stars Global is designed to inform, excite, enthuse, and enlighten the top engineering young professionals and students. The conference brings together the most promising students and young professionals around the world to network and is inspired by each other. The program… IEEE Rising Stars Conference
CES 2022
Las Vegas Covention and World Trade Center 3150 Paradise Rd, Las Vegas, NV, United StatesCES is right around the corner, and the excitement is building! Over 1900 exhibiting companies – with more being added every day – and hundreds of thought leaders from around the world are ready to show you how tech has never been more important in our lives. Key industry audiences are also showing strong commitment: 195 of the Fortune Global… CES 2022
Accelerating Complex SoCs Prototyping with Protium X2
This CadenceTECHTALK will offer an overview of the Protium™ Enterprise Prototyping Platform for fast hardware and software verification. We will review the traditional prototyping challenges of complex SoCs using a 5G AI-enabled mobile SoC case study—RTL changes required for clocks management, memories, interfaces, multi-FPGA partitioning, and multi-user support. Join our CadenceTECHTALK to learn how the… Accelerating Complex SoCs Prototyping with Protium X2
Boost Your CXL Verification from IP to System Level
Register now for this CadenceTECHTALK, where we will walk you through CXL verification challenges from IP level to system level and demonstrate how these challenges can be significantly mitigated using the Cadence® Verification IP (VIP) solution for advanced verification methodologies. Specifically, this webinar will cover following topics: Growing market needs for CXL Verification challenges of… Boost Your CXL Verification from IP to System Level
Mixed-Signal SoC Verification Simplified with Xcelium Simulator
Analog and mixed-signal verification has always been a challenge for design and verification engineers. It has become tedious with the increasing complexity of SoC designs. Because the analog behavior of key design blocks cannot be simulated effectively using traditional verification methodologies, new methodologies and solutions like real number modeling (RNM) for analog functional blocks are… Mixed-Signal SoC Verification Simplified with Xcelium Simulator
SemIsrael Tech Webinar
SemIsrael Expo is the premier professional semiconductor event in Israel. The event brings together hundreds of Israeli semiconductor professionals from all fields and aspects of the semiconductor industry. The Expo will host some 750 semiconductor professionals from all the Israeli semiconductor community; local fabless & startups, local R&D offices of multinationals and IDMs, foundries, design… SemIsrael Tech Webinar
Connect Your System Architecture Design and Implementation
Join Cadence Training and Senior Application Engineer Dave Palumbo for this free technical Training Webinar. The disconnect between system architecture design and implementation makes creating a system that meets cost, performance, and form factor requirements challenging. Hardware designers need tools that help them engineer systems to meet the goals of their end products within the… Connect Your System Architecture Design and Implementation
CadenceTECHTALK: Efficient Multi-Chiplet Design with Integrity 3D-IC Unified Platform
Multi-chiplet design and packaging introduces extra design and analysis requirements like system planning, bump alignment, TSV and micro-bump insertion and extraction, electrothermal analysis, cross-die STA, and inter-die physical verification, which must be considered early during planning and implementation. The new Cadence® Integrity™ 3D-IC platform provides innovative technology that proactively looks ahead through integrated planning, implementation,… CadenceTECHTALK: Efficient Multi-Chiplet Design with Integrity 3D-IC Unified Platform
IMAPS Device Packaging
We-Ko-Pa Resort & Conference Center 10438 Wekopa Way, Fort McDowell, AZ, United StatesThe 18th Annual Device Packaging Conference (DPC 2022) will be held at the WeKoPa Resort and Conference Center, from March 7-10, 2022. It is an international event organized by the International Microelectronics Assembly and Packaging Society (IMAPS). The conference is a major forum for the exchange of knowledge and provides numerous technical, social and networking opportunities for meeting leading experts in… IMAPS Device Packaging