Cadence
How Static and Dynamic IR Drop Analysis Can Help PCB Designs Challenges
As boards become smaller and faster, the environment for thermal issues becomes increasingly challenging. The thermal management of significant resistive losses in PCB and package structures is critical, especially because these resistive losses are also temperature-dependent, making dynamic and static IR drop analysis crucial in addressing the performance and capacity challenges of such designs. Join… How Static and Dynamic IR Drop Analysis Can Help PCB Designs Challenges
Debugging Features of UVM
A UVM testbench is a large and complex piece of software. At some stage, like any other large and complex piece of software, a verification environment written using UVM is going to require debugging. There are various debugging features built into UVM to help with this. In this webinar, Doulos Senior Member Technical Staff, Doug… Debugging Features of UVM
Increase Efficiency and Reduce Risks with IC and Package Co-Design Flows
System designers face increasing challenges in meeting technical specifications and time-to-market requirements. While process nodes continue to shrink, the complexity of packages continues to grow. Large pin counts of flipped and rotated ICs may accidentally lead to I/O misalignment between die and package. Consequently, disjointed design tools and flows create a serious risk of product… Increase Efficiency and Reduce Risks with IC and Package Co-Design Flows
NAFEMS Americas Conference 2022
Indianapolis Convention Center 1861 Monument Circle, Indianapolis, IN, United StatesNAFEMS Americas will be hosting its biennial regional conference, formerly known as CAASE, on June 21-23, 2022, face-to-face, at the Indiana Convention Center in Indianapolis, Indiana! The NAFEMS Americas Regional Conference 2022 (NRC22 Americas) will bring together the leading visionaries, developers, and practitioners of CAE-related technologies in an open forum, unlike any other, to share experiences, discuss relevant trends,… NAFEMS Americas Conference 2022
PIC International Conference
Sheraton Brussels Airport Hotel Brussels, BelgiumThe 6th PIC International conference will build on the success of its predecessors, with industry-leading insiders delivering more than 30 presentations spanning four sectors. Attendees at the two-day conference will gain an up-to-date overview of the status of the global photonics industry, and will have the opportunity to meet many other key players within the… PIC International Conference
Driving Low-Power Design with High-Level Synthesis
With the growth in computing at the edge driven by the explosion of battery-powered smart devices, designing for low power is mission-critical to product success. Numerous techniques, spanning all stages of design, are employed to reduce power. Since many of the low-power design techniques come at a cost in performance, the key design challenge continues… Driving Low-Power Design with High-Level Synthesis
Digital Engineering Best Practices for Aerospace & Defense
Register for this Cadence TECHTALK™ webinar, where senior director of solutions marketing Frank Schirrmeister will discuss how commercial electronics hardware companies use cutting-edge design techniques to ensure that their hardware/software designs work as intended prior to fabrication. This ensures that hardware is built right the first time, in an affordable, sustainable, and agilely modernizable fashion.… Digital Engineering Best Practices for Aerospace & Defense
Flash Memory Summit
Santa Clara Convention Center 5001 Great America Parkway, Santa Clara, CA, United StatesProgram It is ideal for consumer applications such as cellphones, digital cameras, and music players, and is also useful in computers, communications systems, and military/defense applications. It can replace hard disks for storage in applications where its higher cost is balanced by its smaller size, greater ruggedness, and lower power consumption. The summit consists of:… Flash Memory Summit
Sustainability for Semiconductors
Don’t miss your chance to join this important conversation with industry leaders that are making an impact on the reduction of the semiconductor carbon footprint. Donna Yasay Senior Leader, Solutions Architecture at Amazon Web Services (AWS) Donna Yasay leads a solution architecture team for the Bay Area semiconductor segment at Amazon Web Services (AWS). Her team… Sustainability for Semiconductors
SBCCI 2022
35ᵗʰ Symposium on Integrated Circuits and Systems Design SBCCI is an international forum dedicated to integrated circuits and systems design, held annually in Brazil. The 35th SBCCI will be virtual from the Rio Grande do Sul state, Brazil. This originates the name Chip in the Minuano – Minuano wind is the cold southwesterly current of… SBCCI 2022
Integrated Thermal Analysis for RF MMIC and PCB Power Applications
Join us for this one-hour CadenceTECHTALK to learn how the Cadence Celsius Thermal Solver uses design data such as layout geometries, material properties, and dissipated power simulation results from Microwave Office software to provide designers with thermal heat map visualization and operating temperature information. Thermal analysis provides RF circuit designers with insight regarding operating temperatures… Integrated Thermal Analysis for RF MMIC and PCB Power Applications
AESIN Conference
The National Motorcycle Museum B92 OEJ, Solihull, United KingdomWe are delighted to announce the AESIN Conference 2022 to be held on 1 September. This year’s AESIN theme is “Championing Champions.” We will be celebrating UK’s outstanding automotive electronics related organisations as we bring technology to the forefront. The conference will provide a platform for technology champions to share technical expertise and innovation with… AESIN Conference