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he inaugural ‘SemiconIndia 2022’ Conference is being organised by India Semiconductor Mission in partnership with industry and industry associations under the visionary leadership of Hon'ble Prime Minister Shri Narendra Modi with the aim to make India a global hub for Semiconductor Design, Manufacturing and Technology Development which will help propel the vision of India Semiconductor Mission. Theme: Catalyzing India’s Semiconductor… SemiconIndia Conference 2022 |
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1 event,
Siemens EDA User2User North America U2U is your opportunity to learn, share and network with fellow technical experts who design leading-edge products using Siemens EDA tools. Dedicated to end-users of Siemens EDA solutions, this conference is free to attend and includes innovative keynotes from industry leaders, enriching technical sessions as well as a chance to… Siemens EDA – User2User |
2 events,
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Join Cadence Training and Principal Application Engineer Vladimir Papic for this free technical Training Webinar. Cadence® Sigrity™ Aurora is a signal and power integrity (SI/PI) analysis solution, tightly integrated into the Allegro® PCB design environment. Bridging the gap between design and analysis with In-Design Analysis (IDA) features, Sigrity Aurora reads and writes directly to the… Signal and Power Integrity Analysis with Sigrity Aurora |
3 events,
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Cloud has democratized access to increasing compute power by lowering barriers to entry, creating the flexibility to scale elastically, and enabling distributed workloads. But there is more to moving EDA to the cloud than simply swapping on-prem hardware for cloud; software needs the same license flexibility and elasticity to match. Learn how Synopsys Cloud’s disruptive… Rapidly Scale and Reduce Time-to-Market for Your Designs with Synopsys Cloud
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Analog engineers adopting advanced FinFET technologies face many challenges that were not present when using planar transistors. Challenges in layout implementation have a direct impact on design specifications, and the luxury of over-margining is long gone. There are no third-order effects anymore, and managing layout effects, such as device and interconnect parasitics, variation, matching, and EM-IR,… Tackling Advanced Analog FinFET Front-End Design Challenges with Better Methodologies
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Presenter: Espen Tallaksen, CEO of EmLogic Thursday, May 5, 2022 Abstract: For most FPGA projects, over 50% of the overall project time is spent on verification. This time can be significantly reduced if the verification architecture is well-structured and developed with a focus on reuse. In this webinar, we will show you how to make… FPGA Verification Architecture Optimization with UVVM |
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When it comes to learning about the latest tech trends, solving real business challenges, and hearing customer success stories on sustainable innovation, Realize LIVE is the place to be. Here are a few of the can’t-miss customer speakers taking the stage: George Bye CEO Bye Aerospace, Inc. Henrik Alfredsson Managing Director Aker Solutions Stay tuned… Siemens – Realize LIVE Americas |
4 events,
We can’t wait to bring our community back together at the Michigan Science Center in Detroit. Join us 10-12 May to hear from over 50 speakers from companies across the autonomous vehicle perception supply chain, including AMD, BrainChip, Indie Semiconductor, ON Semiconductor, Siemens, STMicroelectronics, Cadence, Valeo, MOBIS, Synopsys, Veoneer, General Motors and Baraja. With a… AutoSense Detroit 2022 
ChipEx2022 The main event of the Israeli semiconductor industry, will be held on May 10, 2022 at the Expo Tel Aviv Conference Center. The event is expected to attract thousands of industry professionals including engineers, development managers, project managers, professional experts, procurement managers and more. ChipEx2022 will include lectures by the best experts from around the world who will deal… ChipEx 2022
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As a result of the pandemic, many semiconductor organizations started looking at cloud solutions to support remote team members. But moving semiconductor design workflows to cloud has several challenges — security concerns, cloud access controls, employees unfamiliar with the technology, and more. Learn more about cloud-based semiconductor design and how to conquer these challenges. Checkout… Methodics User Group |
5 events,
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May 11, 2022 | 9:00am – 12:00pm PT Join us at Virtual Prototyping Day 2022 to hear about the latest deployed virtual prototyping innovations. This event highlights applications from around the world using the latest virtual prototyping technology, covering applications from automotive, AI, and data center domains. Industry leaders will share their experiences… Virtual Prototyping Day 2022
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How do you deal with design requirements that span high performance, energy-efficient computing, and high-reliability implementation? To realize these goals, you need optimal design flows to deliver the best power, performance, and reliability. Join Cadence and Arm virtually for CadenceCONNECT: Arm and Cadence – Achieving Best Silicon Power, Performance, and Area. Learn about: High-performance design… Arm and Cadence: Achieving Best Silicon Power, Performance, and Area |
10 events,
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The 2022 Silicon Leadership Summit will be hosted as the first in-person live event since early 2020. The SLS is GSA’s technology and business conference, an unique platform that brings together executives across the expanded semiconductor ecosystem at the intersection of semiconductors, software, systems, solutions, and services for thought leadership, and collaborative dialogue, providing deep… Silicon Leadership Summit
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U2U is your opportunity to learn, share and network with fellow technical experts who design leading-edge products using Siemens EDA tools. Dedicated to end-users of Siemens EDA solutions, this conference is free to attend and includes innovative keynotes from industry leaders, enriching technical sessions as well as a chance to network with colleagues and peers.… Siemens EDA User2User Europe
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AMBA is a set of interconnect specifications that standardizes on chip communication mechanisms between various functional blocks (or IP) for building SOC designs. Silvaco’s AMBA AHB subsystems provide the basic interconnect and functional subsystems enabling SOC designers to target products such as IoT Devices, Medical Devices, Industrial Controllers, Wireless Gateways, and many more applications. These… AMBA AHB Subsystems and How to Customize, Secure, and Verify |
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2 events,
VOICE Registration is sold out and the event is at full capacity. We apologize for any inconvenience. VOICE is a developer conference, created by test engineers for test engineers. Each year, the VOICE Developer Conference unites semiconductor test professionals representing the world's leading integrated device manufacturers (IDMs), foundries, fabless semiconductor companies and outsourced semiconductor assembly… Advantest VOICE 2022 
The premier event for practical, deployable computer vision and visual AI, for product creators who want to bring visual intelligence to products. The Summit attracts a global audience of technology professionals from companies developing computer vision and edge AI-enabled products including embedded systems, cloud solutions and mobile applications. Why attend? It's a First-Rate Program with… Embedded Vision Summit |
3 events,
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Wednesday, May 18, 2022 | 10:00 - 11:00 a.m. Pacific AI, Graphics, CPU, and many modern designs have arithmetic intensive blocks that are hard to verify with traditional techniques. Synopsys VC Formal DPV (Datapath Validation) has been the industry's golden standard to get closure on datapath verification. In this Synopsys webinar, we will discuss why… Writing C/C++ Models for Efficient Datapath Validation Using VC Formal DPV |
2 events,
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The Peripheral Component Interconnect Express (PCIe®) high-speed interface has become the standard for computer expansion cards due to its high bandwidth combined with manageable component costs. However, the latest PCIe 6.0 release raises new challenges for design engineers, as the popular interface standard moves to pulse-amplitude modulation-4 (PAM-4) signaling for the first time. This webinar… Conquer SI/PI Challenges and Reduce Time to Signoff for PCIe 6.0
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Functional coverage is often mentioned together with constrained-random verification, and this is a great combination. However, functional coverage is also very useful even if you have no randomization at all. This is a great method for ensuring that you are in fact checking the right things in your testbench. Unfortunately, not many designers are applying… FPGA Design/Verification: Code, Functional and Specification Coverage |
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The IEEE International Symposium on Power Semiconductor Devices and ICs (ISPSD) is the premier forum for technical discussions in all areas of power semiconductor devices and power integrated circuits. Topics include, but not limited to, device physics, modelling, design, fabrication, materials, packaging and integration, device reliability, and device/circuit interactions. The conference venue rotates annually through… IEEE ISPSD 2022 |
2 events,
The IEEE European Test Symposium (ETS) is Europe’s premier forum dedicated to presenting and discussing scientific results, emerging ideas, applications, hot topics and new trends in the area of electronic-based circuits and system testing, reliability, security and validation. ETS’22 will be held in Casa Convalescència, located in the historical modernist site Hospital de la Santa… European Test Symposium 2022 |
7 events,
The Xilinx Versal ACAP platform is multi-featured, offering unprecedented system level performance and integration. This informative workshop (delivered in 2 half day sessions) is a comprehensive and practical introduction to the features and capabilities. We’ll first cover the broader Versal ACAP device. We’ll then focus on a practical example, optimizing a given application for the… Versal ACAP Workshop Online
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Pulsic Webinars are back! Fast forward to the future of analog layout with this Mark Waller's webinar. In this webinar you will learn how to shrink your design time by 60% with Animate Preview. You are just one (free) click away from the future of analog design:
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This webinar will help you understand: • The different standards that exist and why is compliance so important? • How to protect against tampering attacks? • What is lifecycle security and how can it benefit the automotive industry? • Why is it important to protect the whole lifecycle of a device?
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The growing use of a variety of sensors in edge devices – from wearables to virtual assistants to automotive radar/LiDAR – requires SoCs to have an optimal balance of DSP performance and low power/area. In addition, SoC developers must be able to easily scale their hardware architectures to handle a varying number of data streams… DSP IP for High Performance Sensor Fusion on an Embedded Budget |
3 events,
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Using virtual prototypes in your continuous integration/continuous delivery (CI/CD) setup can boost your embedded software development team’s productivity. Traditionally, such setups have depended on physical hardware boards, which come with a host of downsides, such as late availability, high cost, and maintenance issues as well as the possibility of damage during testing of fault conditions.… Turbo-Charge Your Embedded CI/CD Setup Using Virtual Prototypes
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OSVVM is an advanced verification methodology that defines a VHDL verification framework, verification utility library, verification component library, and a scripting flow that simplifies your FPGA verification projects from start to finish. Using these libraries, you can create a simple, readable, and powerful testbench that is suitable for either simple or complex FPGA blocks. Looking… Better FPGA Verification with VHDL: OSVVM – Leading Edge Verification for the VHDL Community |
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The IEEE International Symposium on Circuits and Systems (ISCAS) ISCAS 2022 will be held in Austin Texas from May 28 through June 1. Austin is one of the fastest growing cities in the United States. Much of this growth is attributable to the rapidly growing tech sector in the Austin metropolitan area. The large and… ISCAS 2022 |
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4 events,
The Electronic Components and Technology Conference (ECTC) is the premier international event that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange. ECTC is sponsored by the IEEE Electronics Packaging Society. Abstract Submission is Open | Subscribe to our mailing list 
RISC-V Days Tokyo is Japan’s largest online RISC-V event. Live online presentations are hosted on May 31st (Tue), June 1st (Wed) and 2nd (Thu). There will also be a virtual “RISC-V Pavilion” for the last two days. RISC-V Days Tokyo aims to bring together leading RISC-V technologies and products, key persons and engineers, and to… RISC-V Days Tokyo 2022 Spring 
Welcome to ITherm 2022 The Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems May 31 - June 3, 2022 Sheraton Hotel & Marina San Diego, CA USA (Co-Located with ECTC) Sponsored by the IEEE's Electronics Packaging Society (EPS), ITherm 2022 is an international conference for scientific and engineering exploration of thermal, thermomechanical and emerging… ITherm 2022 |
6 events,
WELCOME POWERFUL NETWORK FOR THE COMPUTER ON WHEELS The Automotive Ethernet Congress will take place for the eighth time on June 1 - 2, 2022. The conference program will highlight the entire spectrum of topics relating to the use of Ethernet in vehicles. The vehicle is undergoing the greatest change since its inception. Automation, networking, and digitalization of the… Automotive Ethernet Congress
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Doulos Co-Founder & Technical Fellow John Aynsley will teach the core principles necessary to understand and use SystemVerilog Assertions, focussing on the aspects of SVA that are applicable to both formal verification and simulation. Particular emphasis will be placed on the core semantics of temporal logic so that you will be able to write your own assertions,… Become an SVA Expert in One Hour |
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